XC5VLX155T-3FF1136C

IC FPGA 640 I/O 1136FCBGA
Part Description

Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 640 7815168 155648 1136-BBGA, FCBGA

Quantity 1,520 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1136-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1136-BBGA, FCBGANumber of I/O640Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs12160Number of Logic Elements/Cells155648
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7815168

Overview of XC5VLX155T-3FF1136C – Virtex®-5 LXT Field Programmable Gate Array (FPGA)

The XC5VLX155T-3FF1136C is a Virtex®-5 LXT Field Programmable Gate Array from AMD delivered in a 1136-ball FCBGA package (35 × 35 mm). It provides a high count of programmable logic resources and on-chip memory for complex digital designs while operating within a 0.95–1.05 V core supply range.

With 155,648 logic elements, approximately 7.8 Mbits of embedded memory and 640 user I/O, this commercial-grade FPGA is intended for applications that require dense logic integration, substantial local memory, and a large I/O footprint in a surface-mount FCBGA package.

Key Features

  • Logic Capacity  155,648 logic elements provide a large programmable fabric for implementing complex digital functions and custom hardware acceleration.
  • Embedded Memory  Approximately 7.8 Mbits of on-chip RAM for local data buffering, FIFOs and state storage to support memory-intensive logic blocks.
  • I/O Resources  640 user I/O pins support wide parallel interfaces and flexible connectivity to external devices and subsystems.
  • Core Supply  Operates from a 0.95 V to 1.05 V core voltage range, enabling predictable power-domain design and supply planning.
  • Package & Mounting  1136-FCBGA package (35 × 35 mm) in a surface-mount form factor for board-level integration where a high-ball-count BGA is acceptable.
  • Operating Range  Commercial temperature rating from 0°C to 85°C for deployment in standard commercial environments.
  • Compliance  RoHS compliant to support lead-free manufacturing processes and regulatory requirements.

Typical Applications

  • Custom digital logic and prototyping  Use the large logic element count to implement and validate complex, custom hardware functions and prototypes.
  • Memory-intensive processing  Leverage approximately 7.8 Mbits of embedded RAM for local buffering, packet processing, or intermediate data storage.
  • High-density I/O interfaces  640 I/O pins support wide parallel interfaces, board-level bridging, and high-pin-count peripheral connectivity.

Unique Advantages

  • High programmable capacity: 155,648 logic elements enable large-scale designs without immediate migration to multiple devices.
  • Significant on-chip memory: Approximately 7.8 Mbits of embedded RAM reduces dependence on external memory for many buffering and stateful tasks.
  • Extensive I/O availability: 640 user I/O pins allow direct interfacing to numerous sensors, peripherals, or parallel data paths.
  • Compact, board-ready package: 1136-FCBGA (35 × 35 mm) surface-mount package concentrates resources in a predictable footprint for PCB design.
  • Commercial temperature and RoHS compliance: Rated 0°C to 85°C and RoHS compliant to align with standard commercial manufacturing and deployment requirements.

Why Choose XC5VLX155T-3FF1136C?

The XC5VLX155T-3FF1136C positions itself as a high-capacity, memory-rich Virtex®-5 LXT FPGA suitable for designs that demand large programmable logic, substantial on-chip RAM and broad I/O. Its combination of 155,648 logic elements, approximately 7.8 Mbits of embedded memory and 640 I/O make it well suited to consolidate complex digital functions into a single device.

As a commercial-grade, RoHS-compliant FCBGA offering from AMD, it is appropriate for development and deployment in standard commercial applications where dense logic integration and a high I/O count are priorities. Its FCBGA package and defined power and temperature ranges support predictable system integration and manufacturing planning.

Request a quote or submit an inquiry to receive pricing and availability for the XC5VLX155T-3FF1136C.

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