XC5VLX155T-3FF1136C
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 640 7815168 155648 1136-BBGA, FCBGA |
|---|---|
| Quantity | 1,520 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1136-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1136-BBGA, FCBGA | Number of I/O | 640 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 12160 | Number of Logic Elements/Cells | 155648 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7815168 |
Overview of XC5VLX155T-3FF1136C – Virtex®-5 LXT Field Programmable Gate Array (FPGA)
The XC5VLX155T-3FF1136C is a Virtex®-5 LXT Field Programmable Gate Array from AMD delivered in a 1136-ball FCBGA package (35 × 35 mm). It provides a high count of programmable logic resources and on-chip memory for complex digital designs while operating within a 0.95–1.05 V core supply range.
With 155,648 logic elements, approximately 7.8 Mbits of embedded memory and 640 user I/O, this commercial-grade FPGA is intended for applications that require dense logic integration, substantial local memory, and a large I/O footprint in a surface-mount FCBGA package.
Key Features
- Logic Capacity 155,648 logic elements provide a large programmable fabric for implementing complex digital functions and custom hardware acceleration.
- Embedded Memory Approximately 7.8 Mbits of on-chip RAM for local data buffering, FIFOs and state storage to support memory-intensive logic blocks.
- I/O Resources 640 user I/O pins support wide parallel interfaces and flexible connectivity to external devices and subsystems.
- Core Supply Operates from a 0.95 V to 1.05 V core voltage range, enabling predictable power-domain design and supply planning.
- Package & Mounting 1136-FCBGA package (35 × 35 mm) in a surface-mount form factor for board-level integration where a high-ball-count BGA is acceptable.
- Operating Range Commercial temperature rating from 0°C to 85°C for deployment in standard commercial environments.
- Compliance RoHS compliant to support lead-free manufacturing processes and regulatory requirements.
Typical Applications
- Custom digital logic and prototyping Use the large logic element count to implement and validate complex, custom hardware functions and prototypes.
- Memory-intensive processing Leverage approximately 7.8 Mbits of embedded RAM for local buffering, packet processing, or intermediate data storage.
- High-density I/O interfaces 640 I/O pins support wide parallel interfaces, board-level bridging, and high-pin-count peripheral connectivity.
Unique Advantages
- High programmable capacity: 155,648 logic elements enable large-scale designs without immediate migration to multiple devices.
- Significant on-chip memory: Approximately 7.8 Mbits of embedded RAM reduces dependence on external memory for many buffering and stateful tasks.
- Extensive I/O availability: 640 user I/O pins allow direct interfacing to numerous sensors, peripherals, or parallel data paths.
- Compact, board-ready package: 1136-FCBGA (35 × 35 mm) surface-mount package concentrates resources in a predictable footprint for PCB design.
- Commercial temperature and RoHS compliance: Rated 0°C to 85°C and RoHS compliant to align with standard commercial manufacturing and deployment requirements.
Why Choose XC5VLX155T-3FF1136C?
The XC5VLX155T-3FF1136C positions itself as a high-capacity, memory-rich Virtex®-5 LXT FPGA suitable for designs that demand large programmable logic, substantial on-chip RAM and broad I/O. Its combination of 155,648 logic elements, approximately 7.8 Mbits of embedded memory and 640 I/O make it well suited to consolidate complex digital functions into a single device.
As a commercial-grade, RoHS-compliant FCBGA offering from AMD, it is appropriate for development and deployment in standard commercial applications where dense logic integration and a high I/O count are priorities. Its FCBGA package and defined power and temperature ranges support predictable system integration and manufacturing planning.
Request a quote or submit an inquiry to receive pricing and availability for the XC5VLX155T-3FF1136C.

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