XC5VLX20T-1FFG323C

IC FPGA 172 I/O 323FCBGA
Part Description

Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 172 958464 19968 323-BBGA, FCBGA

Quantity 1,192 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package323-FCBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case323-BBGA, FCBGANumber of I/O172Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs1560Number of Logic Elements/Cells19968
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits958464

Overview of XC5VLX20T-1FFG323C – Virtex®-5 LXT FPGA, 323-FCBGA, 172 I/O

The XC5VLX20T-1FFG323C is a Virtex®-5 LXT Field Programmable Gate Array (FPGA) in a 323-FCBGA (19×19) surface-mount package. It is offered as a commercial-grade device with RoHS-compliant construction.

This device provides approximately 19,968 logic elements and approximately 0.96 Mbits of embedded memory (958,464 bits), along with 172 I/O pins. It operates from a core voltage supply of 0.95 V to 1.05 V and across a commercial temperature range of 0 °C to 85 °C.

Key Features

  • Logic Capacity Approximately 19,968 logic elements for implementing custom digital functions and control logic.
  • Embedded Memory Approximately 0.96 Mbits of on-chip RAM (958,464 bits) to support buffering, tables and state storage.
  • I/O 172 I/O pins to accommodate a wide range of external interfaces and peripherals.
  • Power Core voltage supply range 0.95 V to 1.05 V for the device's internal power domain.
  • Package & Mounting 323-FCBGA (19×19) surface-mount package; package case listed as 323-BBGA, FCBGA.
  • Operating Range Commercial-grade operating temperature from 0 °C to 85 °C.
  • Environmental Compliance RoHS-compliant construction for lead-free assemblies.

Typical Applications

  • Commercial embedded systems Implement custom logic and control functions in systems requiring a commercial temperature rating, substantial logic capacity and multiple I/O.
  • Prototyping and development Leverage the device's logic capacity and on-chip RAM to develop and validate hardware-accelerated functions in a compact FCBGA package.
  • Board-level integration Surface-mount 323-FCBGA package enables dense PCB layouts where package size and I/O count are important design considerations.

Unique Advantages

  • High logic density: Approximately 19,968 logic elements provide capacity for complex digital designs.
  • Integrated memory: Approximately 0.96 Mbits of embedded RAM reduces dependence on external memory for buffering and lookup tables.
  • Generous I/O count: 172 I/O pins support broad external connectivity without immediate need for expansion devices.
  • Compact FCBGA package: 323-FCBGA (19×19) surface-mount form factor enables compact system implementations.
  • Commercial temperature rating: Rated 0 °C to 85 °C to meet typical commercial application requirements.
  • RoHS compliant: Suitable for lead-free assembly processes.

Why Choose XC5VLX20T-1FFG323C?

The XC5VLX20T-1FFG323C delivers a balanced combination of substantial logic resources, embedded memory and a high I/O count within a compact 323-FCBGA surface-mount package. Its commercial-grade temperature rating and defined core voltage range make it appropriate for a wide range of commercial embedded designs that require on-chip capacity and connectivity.

For projects that prioritize integration and predictable device parameters—logic elements, embedded RAM, I/O count, package and operating conditions—this Virtex‑5 LXT FPGA provides a clear, specification-driven option supported by the Virtex‑5 series technical documentation.

Request a quote or submit an inquiry to obtain pricing and availability for the XC5VLX20T-1FFG323C.

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