XC5VLX220-1FF1760I

The XC5VLX220-1FF1760I is an AMD Virtex-5 LX field programmable gate array supplied in a 1760-FCBGA package. It provides a high-density, reprogrammable logic fabric with a large on-chip memory complement and a substantial I/O count for advanced embedded and industrial designs.

With 221,184 logic elements, approximately 7.08 Mbits of embedded memory, and 800 I/O pins, this device targets designs requiring significant logic capacity, memory resources, and extensive external connectivity while operating across an industrial temperature range and a low-voltage core supply.

Key Features

• Logic Capacity — 221,184 logic elements provide substantial programmable logic resources for complex custom logic, parallel processing, and control functions.
• Embedded Memory — Approximately 7.08 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive algorithms without external memory dependence.
• I/O Resources — 800 general-purpose I/O pins to enable broad connectivity with peripherals, sensors, and external interfaces.
• Power and Core Voltage — Core voltage supply range of 0.95 V to 1.05 V, supporting tight power budgeting and standard core-voltage domains.
• Package and Mounting — 1760-FCBGA (42.5 × 42.5 mm) package in a surface-mount form factor for high-density PCB implementations.
• Temperature and Grade — Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
• Compliance — RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Industrial Control and Automation — Programmable logic and plentiful I/O for implementing control algorithms, interfacing sensors, and coordinating machinery in industrial systems.
• High-Density Digital Processing — Large logic and embedded memory resources suitable for custom data-paths, parallel processing, and signal processing building blocks.
• Prototyping and Custom IP — Reconfigurable fabric sized for proof-of-concept prototypes and deployment of custom IP cores requiring significant logic and memory.
• Communications and I/O Aggregation — High I/O count enables aggregation and bridging of multiple interfaces and front-end connectivity in communications equipment.

Unique Advantages

• High logic density: 221,184 logic elements allow large-scale integration of custom logic and concurrent functions on a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 7.08 Mbits of embedded RAM lowers reliance on external memory, improving latency and simplifying system BOM.
• Extensive I/O: 800 I/Os provide flexibility to connect many peripherals and interfaces without additional interface chips.
• Industrial operating range: Rated −40 °C to 100 °C to support deployment in applications exposed to wide temperature variation.
• Compact, surface-mount FCBGA package: 1760-FCBGA (42.5 × 42.5 mm) supports high-density PCB layouts and reliable soldered mounting.
• RoHS compliant: Meets lead-free manufacturing requirements for modern electronics production.

Why Choose XC5VLX220-1FF1760I?

The XC5VLX220-1FF1760I combines large programmable logic resources, multiple megabits of embedded memory, and a high I/O count in a robust industrial-grade package. These attributes make it well suited for engineers designing complex embedded systems, industrial controllers, and densely integrated digital processing solutions that require on-chip capacity and broad connectivity.

Choosing this device offers a balance of integration and environmental robustness: substantial logic and memory capacity reduce system-level component count, the industrial temperature rating supports deployment in challenging conditions, and the FCBGA surface-mount package enables compact PCB integration.

Request a quote or submit an inquiry to get pricing and availability information for the XC5VLX220-1FF1760I. Our team can provide lead-time and order support to help integrate this device into your design.