XC5VLX220-2FF1760I

The XC5VLX220-2FF1760I is a Virtex®-5 LX field programmable gate array (FPGA) offered in a 1760-ball FCBGA package. This device provides a high density of programmable logic and on-chip memory with a large I/O count, targeting industrial applications that require reconfigurable logic, significant embedded memory, and robust thermal range.

Key Features

• Logic Capacity 221,184 logic elements for implementing complex, high-density custom logic and parallel datapaths.
• Configurable Logic Blocks (CLBs) 17,280 CLBs to organize and deploy large-scale logic designs.
• Embedded Memory Approximately 7.08 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory.
• I/O Density Up to 800 I/O pins to accommodate multi-channel interfaces, wide buses, and dense board-level connectivity.
• Power Supply Core voltage supply range of 0.95 V to 1.05 V to match system power architecture and ensure stable core operation.
• Package and Mounting 1760-FCBGA (42.5 × 42.5 mm) package in a surface-mount form factor for compact board integration.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C for reliable performance in demanding environments.
• Environmental Compliance RoHS compliant to meet common regulatory and manufacturing requirements.

Typical Applications

• Industrial Control Systems Industrial-grade temperature rating and high logic density support automation, motor control, and control-plane processing in industrial equipment.
• High-Density I/O Systems Up to 800 I/O pins enable implementations requiring multiple interfaces, wide data buses, or dense sensor/actuator connections.
• Memory-Intensive Embedded Designs Approximately 7.08 Mbits of embedded memory supports on-chip buffering, packet queues, and local data storage to reduce external memory dependence.

Unique Advantages

• High Logic Integration: 221,184 logic elements allow consolidation of complex algorithms and parallel processing onto a single device, simplifying system architecture.
• Large Embedded RAM: Approximately 7.08 Mbits of on-chip RAM reduces the need for external memory in many designs, lowering BOM complexity.
• Extensive I/O: 800 I/O pins provide flexibility for multiple interfaces and high channel counts without multiple FPGAs.
• Industrial Reliability: Rated for −40 °C to 100 °C operation to suit equipment deployed in demanding temperature environments.
• Compact, Surface-Mount FCBGA: 1760-FCBGA (42.5 × 42.5 mm) package supports high-density board layouts while maintaining manufacturing compatibility with surface-mount processes.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and assembly requirements.

Why Choose XC5VLX220-2FF1760I?

The XC5VLX220-2FF1760I combines substantial programmable logic, a large pool of embedded RAM, and extensive I/O in a single industrial-grade FPGA package. Its operating temperature range and surface-mount 1760-FCBGA footprint make it suitable for industrial applications where integration density and on-chip resources are prioritized.

Designs that demand significant on-chip memory, many I/O channels, and high logic capacity will benefit from the consolidation this device enables, reducing board-level complexity and supporting scalable, reconfigurable implementations.

Request a quote or submit a purchase inquiry to evaluate the XC5VLX220-2FF1760I for your next design.