XC5VLX20T-3FFG323C

IC FPGA 172 I/O 323FCBGA
Part Description

Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 172 958464 19968 323-BBGA, FCBGA

Quantity 1,311 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package323-FCBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case323-BBGA, FCBGANumber of I/O172Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs1560Number of Logic Elements/Cells19968
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits958464

Overview of XC5VLX20T-3FFG323C – Virtex®-5 LXT FPGA IC, 172 I/Os, 323‑FCBGA

The XC5VLX20T-3FFG323C is a Virtex®-5 LXT field programmable gate array (FPGA) IC designed for applications that require reconfigurable digital logic and embedded on-chip memory. It provides a combination of logic capacity, I/O density and a compact 323‑FCBGA package suitable for surface-mount integration in commercial-temperature designs.

Key attributes include 19,968 logic elements and approximately 0.96 Mbits of embedded memory, a supply voltage range of 0.95 V to 1.05 V, and 172 user I/O pins — all manufactured by AMD as part of the Virtex-5 LXT family.

Key Features

  • Logic Capacity 19,968 logic elements provide substantial reconfigurable logic resources for implementing complex digital functions.
  • Embedded Memory Approximately 0.96 Mbits of on-chip RAM for buffering, lookup tables and local data storage.
  • I/O Density 172 user I/O pins enable dense external interfacing and connectivity in a single device.
  • Power Core supply range of 0.95 V to 1.05 V supports standard FPGA core power rails.
  • Package and Mounting 323‑FCBGA package (19 × 19) in a surface-mount form factor for compact board-level integration.
  • Operating Conditions Commercial operating temperature range of 0 °C to 85 °C, suitable for typical commercial electronic systems.
  • Compliance RoHS compliant, meeting common environmental requirements for lead-free manufacturing.

Typical Applications

  • System Prototyping and Development Use the device’s 19,968 logic elements and on-chip RAM to prototype and validate custom digital designs.
  • High‑Density I/O Interfaces 172 I/O pins in a 323‑FCBGA package support designs that require multiple external interfaces or parallel connections.
  • Embedded Logic and Acceleration Approximately 0.96 Mbits of embedded memory supports local buffering and acceleration of specialized logic functions.

Unique Advantages

  • Substantial Logic Resource: 19,968 logic elements allow implementation of sizeable custom digital architectures without immediate need for external logic expansion.
  • Integrated Memory Capacity: Nearly 1 Mbit of on-chip RAM reduces dependence on external memory for small to moderate buffering needs.
  • High I/O Count in Compact Package: 172 I/Os in a 323‑FCBGA package deliver a balance of connectivity and board-space efficiency for dense designs.
  • Commercial Temperature Compatibility: Rated for 0 °C to 85 °C, the device suits a wide range of commercial electronic applications.
  • RoHS Compliant: Supports lead-free manufacturing and common environmental compliance requirements.
  • AMD Virtex‑5 LXT Family: Manufactured by AMD as part of the Virtex‑5 LXT family, providing a known platform for FPGA-based designs.

Why Choose XC5VLX20T-3FFG323C?

The XC5VLX20T-3FFG323C positions itself as a commercially rated Virtex‑5 LXT FPGA that combines nearly 20k logic elements, approximately 0.96 Mbits of embedded RAM, and 172 I/Os in a compact 323‑FCBGA surface-mount package. These characteristics make it a practical choice for engineers who need reconfigurable logic, local memory, and substantial I/O density within standard commercial operating conditions.

Backed by AMD’s Virtex‑5 LXT lineage, the device is suited for design teams focused on prototyping, embedded acceleration, and dense I/O implementations where integration and verified silicon are important for time-to-market and design scalability.

Request a quote or submit a pricing and availability inquiry to receive part-specific lead-time and purchasing information.

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