XC5VLX20T-3FFG323C
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 172 958464 19968 323-BBGA, FCBGA |
|---|---|
| Quantity | 1,311 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 323-FCBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 323-BBGA, FCBGA | Number of I/O | 172 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 1560 | Number of Logic Elements/Cells | 19968 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 958464 |
Overview of XC5VLX20T-3FFG323C – Virtex®-5 LXT FPGA IC, 172 I/Os, 323‑FCBGA
The XC5VLX20T-3FFG323C is a Virtex®-5 LXT field programmable gate array (FPGA) IC designed for applications that require reconfigurable digital logic and embedded on-chip memory. It provides a combination of logic capacity, I/O density and a compact 323‑FCBGA package suitable for surface-mount integration in commercial-temperature designs.
Key attributes include 19,968 logic elements and approximately 0.96 Mbits of embedded memory, a supply voltage range of 0.95 V to 1.05 V, and 172 user I/O pins — all manufactured by AMD as part of the Virtex-5 LXT family.
Key Features
- Logic Capacity 19,968 logic elements provide substantial reconfigurable logic resources for implementing complex digital functions.
- Embedded Memory Approximately 0.96 Mbits of on-chip RAM for buffering, lookup tables and local data storage.
- I/O Density 172 user I/O pins enable dense external interfacing and connectivity in a single device.
- Power Core supply range of 0.95 V to 1.05 V supports standard FPGA core power rails.
- Package and Mounting 323‑FCBGA package (19 × 19) in a surface-mount form factor for compact board-level integration.
- Operating Conditions Commercial operating temperature range of 0 °C to 85 °C, suitable for typical commercial electronic systems.
- Compliance RoHS compliant, meeting common environmental requirements for lead-free manufacturing.
Typical Applications
- System Prototyping and Development Use the device’s 19,968 logic elements and on-chip RAM to prototype and validate custom digital designs.
- High‑Density I/O Interfaces 172 I/O pins in a 323‑FCBGA package support designs that require multiple external interfaces or parallel connections.
- Embedded Logic and Acceleration Approximately 0.96 Mbits of embedded memory supports local buffering and acceleration of specialized logic functions.
Unique Advantages
- Substantial Logic Resource: 19,968 logic elements allow implementation of sizeable custom digital architectures without immediate need for external logic expansion.
- Integrated Memory Capacity: Nearly 1 Mbit of on-chip RAM reduces dependence on external memory for small to moderate buffering needs.
- High I/O Count in Compact Package: 172 I/Os in a 323‑FCBGA package deliver a balance of connectivity and board-space efficiency for dense designs.
- Commercial Temperature Compatibility: Rated for 0 °C to 85 °C, the device suits a wide range of commercial electronic applications.
- RoHS Compliant: Supports lead-free manufacturing and common environmental compliance requirements.
- AMD Virtex‑5 LXT Family: Manufactured by AMD as part of the Virtex‑5 LXT family, providing a known platform for FPGA-based designs.
Why Choose XC5VLX20T-3FFG323C?
The XC5VLX20T-3FFG323C positions itself as a commercially rated Virtex‑5 LXT FPGA that combines nearly 20k logic elements, approximately 0.96 Mbits of embedded RAM, and 172 I/Os in a compact 323‑FCBGA surface-mount package. These characteristics make it a practical choice for engineers who need reconfigurable logic, local memory, and substantial I/O density within standard commercial operating conditions.
Backed by AMD’s Virtex‑5 LXT lineage, the device is suited for design teams focused on prototyping, embedded acceleration, and dense I/O implementations where integration and verified silicon are important for time-to-market and design scalability.
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