XC5VLX20T-2FFG323C

IC FPGA 172 I/O 323FCBGA
Part Description

Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 172 958464 19968 323-BBGA, FCBGA

Quantity 1,884 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package323-FCBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case323-BBGA, FCBGANumber of I/O172Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs1560Number of Logic Elements/Cells19968
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits958464

Overview of XC5VLX20T-2FFG323C – Virtex®-5 LXT FPGA, 323-BBGA (FCBGA)

The XC5VLX20T-2FFG323C is a Virtex®-5 LXT field programmable gate array (FPGA) in a 323-ball FCBGA package designed for commercial applications. It provides a balance of programmable logic, on-chip memory, and I/O density for designs requiring flexible hardware acceleration and complex interfacing.

Key device characteristics include 19,968 logic elements, approximately 0.96 Mbits of embedded memory, 172 I/O pins, a 323-BBGA FCBGA (19×19) package, and a core voltage supply range of 0.95 V to 1.05 V, supporting deployment across a variety of commercial embedded systems within an operating temperature range of 0 °C to 85 °C.

Key Features

  • Programmable Logic  19,968 logic elements provide programmable fabric for custom logic, state machines, and hardware acceleration.
  • Embedded Memory  Approximately 0.96 Mbits of on-chip RAM for buffering, FIFOs, and small data storage directly on the FPGA fabric.
  • I/O Capacity  172 I/O pins to support multiple parallel interfaces, peripheral connections, and signal routing within compact systems.
  • Package  323-BBGA FCBGA package (supplier package: 323-FCBGA, 19×19) enabling a compact, surface-mount footprint for high-density board designs.
  • Power  Core voltage supply range of 0.95 V to 1.05 V to match system power domains and regulator designs.
  • Thermal and Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C suitable for general-purpose electronics.
  • Mounting  Surface-mount device for standard PCB assembly processes.
  • Compliance  RoHS compliant for environmental and regulatory considerations.

Typical Applications

  • Embedded Logic and Acceleration  Use the programmable fabric and 19,968 logic elements to implement custom datapaths, state machines, and hardware accelerators in commercial embedded systems.
  • I/O-Intensive Interfaces  Leverage 172 I/O pins to connect multiple sensors, peripherals, or parallel interfaces in communication and control applications.
  • On-Chip Data Buffering  Approximately 0.96 Mbits of embedded RAM supports temporary data storage, buffering, and small lookup tables within the FPGA fabric.

Unique Advantages

  • Balanced Logic and Memory:  19,968 logic elements combined with approximately 0.96 Mbits of embedded memory deliver a versatile resource mix for varied design needs.
  • High I/O Count:  172 I/Os enable flexible system integration and multiple parallel interfaces without immediate need for external I/O expanders.
  • Compact FCBGA Package:  The 323-BBGA (323-FCBGA, 19×19) package offers a dense, surface-mount solution for space-constrained PCBs.
  • Commercial Temperature Range:  Rated 0 °C to 85 °C to match typical commercial electronics operating environments.
  • Regulatory Compliance:  RoHS compliance supports environmental requirements for many regional markets.

Why Choose XC5VLX20T-2FFG323C?

The XC5VLX20T-2FFG323C positions itself as a flexible commercial-grade FPGA option that combines a substantial logic element count, on-chip memory, and a high I/O complement in a compact FCBGA package. It is suited for designers who need programmable hardware resources and significant I/O capacity within standard commercial temperature and power envelopes.

With RoHS compliance and a defined core voltage and operating temperature range, this device fits into procurement and design processes for a wide range of embedded systems where integration, predictable supply requirements, and surface-mount packaging are priorities.

Request a quote or submit an inquiry to get pricing and availability for the XC5VLX20T-2FFG323C for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up