XC5VLX20T-1FF323I
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 172 958464 19968 323-BBGA, FCBGA |
|---|---|
| Quantity | 1,023 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 323-FCBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 323-BBGA, FCBGA | Number of I/O | 172 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 1560 | Number of Logic Elements/Cells | 19968 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 958464 |
Overview of XC5VLX20T-1FF323I – Virtex®-5 LXT FPGA, 323-FCBGA (19×19)
The XC5VLX20T-1FF323I is a Virtex-5 LXT field programmable gate array (FPGA) IC from AMD, supplied in a 323-ball FCBGA package. It delivers a combination of dense programmable logic, embedded memory, and a high I/O count targeted at industrial-grade embedded designs.
With 19,968 logic elements, approximately 0.96 Mbits of on-chip RAM and 172 I/Os, this device is suited to applications that require substantial logic capacity, significant local memory, and robust I/O interfacing within an industrial temperature range.
Key Features
- Core Logic 19,968 logic elements provide extensive programmable logic capacity for custom digital functions and control logic.
- Embedded Memory Approximately 0.96 Mbits (958,464 bits) of on-chip RAM to support buffering, local storage, and memory-backed logic implementations.
- I/O Capability 172 available I/Os to support a wide range of external interfaces and parallel connectivity.
- Package & Mounting Available in a 323-BBGA / 323-FCBGA package (supplier package: 323-FCBGA (19×19)); surface-mount device form factor for compact board designs.
- Power Core voltage range specified at 950 mV to 1.05 V, allowing designers to plan power delivery requirements precisely.
- Temperature & Grade Industrial-grade device with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
- Compliance RoHS-compliant manufacturing status.
Typical Applications
- Industrial Control & Automation Implement machine control logic and sensor interfacing using the device’s substantial logic capacity and industrial temperature rating.
- Communications & Networking Handle protocol processing and parallel data interfacing with the high I/O count and embedded memory for buffering.
- Signal Processing & Imaging Support custom data-paths and local storage for intermediate results using the on-chip RAM and dense logic resources.
- Custom Embedded Systems Integrate application-specific accelerators and control logic where compact FCBGA packaging and surface-mount assembly are required.
Unique Advantages
- Dense Logic Integration: 19,968 logic elements enable consolidation of complex digital functions into a single FPGA, reducing external component count.
- On-Chip Memory for Local Storage: Approximately 0.96 Mbits of embedded RAM supports buffering and state storage close to processing logic, improving data throughput.
- Extensive I/O Reach: 172 I/Os provide flexibility for connecting multiple peripherals, interfaces, and parallel sensors without external multiplexing.
- Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployments in harsh or temperature-variable environments.
- Compact FCBGA Packaging: 323-FCBGA (19×19) package reduces PCB footprint while enabling high pin density for complex designs.
- RoHS Compliance: Environmentally compliant manufacturing status helps meet lead-free assembly requirements.
Why Choose XC5VLX20T-1FF323I?
The XC5VLX20T-1FF323I positions itself as an industrial-grade FPGA that balances substantial logic resources, embedded memory, and a high I/O count within a compact FCBGA package. Its specified core voltage range and wide operating temperature make it suitable for engineered systems where predictable power planning and environmental robustness are required.
This device is appropriate for designers building industrial control, communication, signal processing, or other embedded applications that need dense programmable logic, local RAM, and flexible interfacing in a surface-mount BGA form factor.
Request a quote or submit a procurement inquiry to obtain pricing, availability, and support for the XC5VLX20T-1FF323I.

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