XC5VLX155T-3FFG1136C
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 640 7815168 155648 1136-BBGA, FCBGA |
|---|---|
| Quantity | 32 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1136-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1136-BBGA, FCBGA | Number of I/O | 640 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 12160 | Number of Logic Elements/Cells | 155648 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7815168 |
Overview of XC5VLX155T-3FFG1136C – Virtex®-5 LXT FPGA, 155,648 logic elements
The XC5VLX155T-3FFG1136C is a Virtex®-5 LXT field programmable gate array (FPGA) from AMD. It delivers high logic density, substantial embedded memory, and a large I/O complement in a 1136-FCBGA surface-mount package.
This device is suited to designs that require significant on-chip logic and memory resources while operating at a 0.95 V to 1.05 V core supply and within a commercial temperature range of 0 °C to 85 °C.
Key Features
- Logic Resources – 155,648 logic elements provide extensive programmable fabric for complex digital logic implementations.
- Embedded Memory – Approximately 7.8 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive functions without external memory.
- I/O Capacity – 640 I/O pins to accommodate wide parallel interfaces, multiple peripherals, and board-level connectivity.
- Package & Mounting – 1136-FCBGA (35 × 35 mm) package, surface mount, delivering a compact footprint for high-density board designs.
- Power – Core supply range of 0.95 V to 1.05 V for standard Virtex-5 LXT core operation.
- Operating Conditions – Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Compliance – RoHS-compliant construction for regulatory alignment in commercial applications.
Unique Advantages
- High logic density: 155,648 logic elements enable implementation of large-scale digital designs without partitioning across multiple devices.
- Significant on-chip memory: Approximately 7.8 Mbits of embedded RAM reduces dependence on external memories and simplifies board design.
- Extensive I/O count: 640 I/Os allow flexible interfacing to wide buses, high-pin-count peripherals, and parallel data paths.
- Compact FCBGA packaging: The 1136-FCBGA (35 × 35 mm) package offers a dense solution for space-constrained, high-performance boards.
- Controlled core voltage: Narrow core supply range (0.95 V–1.05 V) supports predictable power integration and regulator selection.
- Commercial-grade and RoHS-compliant: Designed for commercial temperature operation with RoHS compliance for broad market deployment.
Why Choose XC5VLX155T-3FFG1136C?
The XC5VLX155T-3FFG1136C positions itself as a high-density Virtex-5 LXT FPGA that combines a large logic fabric, substantial embedded RAM, and a high I/O count in a single 1136-FCBGA package. These attributes make it appropriate for designs that need consolidated programmable logic, on-chip memory, and extensive connectivity within commercial temperature limits.
As an AMD Virtex-5 LXT device, it offers a solution for teams seeking a reliable, high-capacity FPGA platform with clear electrical and mechanical parameters for supply integration and board planning.
Request a quote or submit a procurement inquiry to receive pricing and availability for the XC5VLX155T-3FFG1136C.

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