XC5VLX155T-3FFG1136C

IC FPGA 640 I/O 1136FCBGA
Part Description

Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 640 7815168 155648 1136-BBGA, FCBGA

Quantity 32 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1136-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1136-BBGA, FCBGANumber of I/O640Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs12160Number of Logic Elements/Cells155648
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7815168

Overview of XC5VLX155T-3FFG1136C – Virtex®-5 LXT FPGA, 155,648 logic elements

The XC5VLX155T-3FFG1136C is a Virtex®-5 LXT field programmable gate array (FPGA) from AMD. It delivers high logic density, substantial embedded memory, and a large I/O complement in a 1136-FCBGA surface-mount package.

This device is suited to designs that require significant on-chip logic and memory resources while operating at a 0.95 V to 1.05 V core supply and within a commercial temperature range of 0 °C to 85 °C.

Key Features

  • Logic Resources – 155,648 logic elements provide extensive programmable fabric for complex digital logic implementations.
  • Embedded Memory – Approximately 7.8 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive functions without external memory.
  • I/O Capacity – 640 I/O pins to accommodate wide parallel interfaces, multiple peripherals, and board-level connectivity.
  • Package & Mounting – 1136-FCBGA (35 × 35 mm) package, surface mount, delivering a compact footprint for high-density board designs.
  • Power – Core supply range of 0.95 V to 1.05 V for standard Virtex-5 LXT core operation.
  • Operating Conditions – Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance – RoHS-compliant construction for regulatory alignment in commercial applications.

Unique Advantages

  • High logic density: 155,648 logic elements enable implementation of large-scale digital designs without partitioning across multiple devices.
  • Significant on-chip memory: Approximately 7.8 Mbits of embedded RAM reduces dependence on external memories and simplifies board design.
  • Extensive I/O count: 640 I/Os allow flexible interfacing to wide buses, high-pin-count peripherals, and parallel data paths.
  • Compact FCBGA packaging: The 1136-FCBGA (35 × 35 mm) package offers a dense solution for space-constrained, high-performance boards.
  • Controlled core voltage: Narrow core supply range (0.95 V–1.05 V) supports predictable power integration and regulator selection.
  • Commercial-grade and RoHS-compliant: Designed for commercial temperature operation with RoHS compliance for broad market deployment.

Why Choose XC5VLX155T-3FFG1136C?

The XC5VLX155T-3FFG1136C positions itself as a high-density Virtex-5 LXT FPGA that combines a large logic fabric, substantial embedded RAM, and a high I/O count in a single 1136-FCBGA package. These attributes make it appropriate for designs that need consolidated programmable logic, on-chip memory, and extensive connectivity within commercial temperature limits.

As an AMD Virtex-5 LXT device, it offers a solution for teams seeking a reliable, high-capacity FPGA platform with clear electrical and mechanical parameters for supply integration and board planning.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XC5VLX155T-3FFG1136C.

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