XC5VLX220-1FFG1760C

The XC5VLX220-1FFG1760C is a Virtex®-5 LX field programmable gate array from AMD, provided in a 1760-ball FCBGA package. It offers a large programmable logic fabric with 221,184 logic elements, substantial on-chip memory, and up to 800 I/O pins for high-density digital designs.

Engineered for commercial applications, the device operates from a core supply range of 950 mV to 1.05 V and across a 0 °C to 85 °C temperature range, and is supplied as a surface-mount, RoHS-compliant device.

Key Features

• Programmable Logic Capacity — 221,184 logic elements to support complex digital functions and high-density logic integration.
• Embedded Memory — Approximately 7.08 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic blocks.
• I/O Count — Up to 800 I/O pins to support broad external interfacing and parallel connectivity.
• Package — 1760-ball BGA (1760-FCBGA) with 42.5 × 42.5 mm supplier package dimensions for compact, high-density board layouts.
• Power — Core voltage supply range from 950 mV to 1.05 V to match system power delivery requirements.
• Thermal and Mounting — Surface-mount device rated for commercial temperature operation from 0 °C to 85 °C.
• Compliance — RoHS-compliant manufacturing status.

Typical Applications

• Complex digital systems — Large logic capacity and embedded memory enable implementation of extensive custom logic, datapaths, and state machines.
• High-density I/O designs — Up to 800 I/Os support parallel interfaces, bus bridging, and multi-channel signal routing.
• Memory-intensive functions — Approximately 7.08 Mbits of on-chip RAM supports buffering, look-up tables, and local data storage for accelerated processing.

Unique Advantages

• High programmable capacity: 221,184 logic elements reduce the need for multiple devices when implementing large designs, simplifying system architecture.
• Significant embedded memory: Approximately 7.08 Mbits of on-chip RAM minimizes external memory requirements and improves data locality.
• Extensive external connectivity: 800 I/Os provide flexibility for parallel interfaces, custom connectors, and dense peripheral integration.
• Compact BGA packaging: 1760-FCBGA (42.5 × 42.5 mm) enables high-density PCB implementations while keeping a single-device solution footprint.
• Commercial grade and RoHS compliant: Suitable for commercial applications where standard temperature and environmental compliance are required.

Why Choose XC5VLX220-1FFG1760C?

The XC5VLX220-1FFG1760C combines a large logic fabric, substantial embedded memory, and a high I/O count in a single commercial-grade FCBGA package. These attributes make it well suited for designs that demand high-density programmable logic and significant on-chip storage without spreading functionality across multiple devices.

Choosing this Virtex®-5 LX FPGA provides a scalable platform for complex digital implementations while maintaining RoHS compliance and standard commercial temperature operation. Its package and electrical characteristics support compact board designs and straightforward integration into systems that operate within the specified voltage and temperature ranges.

Request a quote or submit a parts inquiry today to receive pricing and availability for the XC5VLX220-1FFG1760C.