XC5VLX220-2FFG1760C

The XC5VLX220-2FFG1760C is a Virtex-5 LX field programmable gate array (FPGA) in a 1760-ball FCBGA package designed for commercial applications. It integrates large programmable logic capacity, embedded memory, and extensive I/O within a surface-mount package suitable for dense board-level integration.

Key Features

• Core / Logic 221,184 logic elements (cells) providing substantial programmable logic resources; CLB count listed as 17,280.
• Embedded Memory Approximately 7.08 Mbits of embedded memory (7,077,888 total RAM bits) for on-chip data storage and buffering.
• I/O Connectivity 800 user I/Os to support wide external interface requirements and high pin-count designs.
• Power Supply Core voltage supply range of 0.950 V to 1.05 V to match system power architectures and enable predictable power planning.
• Package & Mounting 1760-BBGA (1760-FCBGA, 42.5 × 42.5 mm) surface-mount package for compact, high-density board implementation.
• Operating Conditions & Grade Commercial-grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

• Commercial Embedded Systems Use as a central programmable logic element in commercial electronic products requiring large FPGA capacity and many I/Os.
• High‑Pin-Count Interface Gateways Suitable where numerous external connections and on-chip routing are needed for bridging or protocol handling.
• Data buffering and on-chip storage Embedded memory supports local buffering, FIFOs, and temporary data storage inside complex logic designs.

Unique Advantages

• Substantial Logic Capacity: 221,184 logic elements provide the headroom required for large logic designs and complex custom architectures.
• Significant On‑Chip Memory: Approximately 7.08 Mbits of embedded RAM reduces external memory dependency and simplifies board-level BOM.
• High I/O Count: 800 user I/Os enable flexible interfacing to multiple peripherals and parallel buses without excessive external glue logic.
• Compact Ball Grid Package: The 1760-FCBGA (42.5 × 42.5 mm) package supports high-density PCB layouts while maintaining robust pinout density.
• Commercial Grade and RoHS Compliant: Designed for commercial temperature ranges and compliant with RoHS requirements for regulatory alignment.

Why Choose XC5VLX220-2FFG1760C?

The XC5VLX220-2FFG1760C positions a large Virtex-5 LX FPGA fabric into a 1760-ball FCBGA package, combining extensive logic resources, sizable embedded memory, and a high I/O count for demanding commercial designs. Its specified core voltage range and surface-mount FCBGA package make it straightforward to integrate into power- and space-constrained board layouts.

This device is well suited for engineers and teams developing commercial embedded systems that require scalable programmable logic, significant on-chip RAM, and broad external connectivity while maintaining RoHS compliance and defined operating temperature limits.

Request a quote or submit an inquiry to receive pricing and availability for the XC5VLX220-2FFG1760C and to discuss how its logic, memory, and I/O resources align with your project requirements.