XC5VLX220T-1FF1136I
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 640 7815168 221184 1136-BBGA, FCBGA |
|---|---|
| Quantity | 1,198 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1136-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1136-BBGA, FCBGA | Number of I/O | 640 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 17280 | Number of Logic Elements/Cells | 221184 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 7815168 |
Overview of XC5VLX220T-1FF1136I – Virtex®-5 LXT FPGA, 1136-FCBGA
The XC5VLX220T-1FF1136I is a Virtex®-5 LXT field programmable gate array (FPGA) IC from AMD, delivered in a 1136-ball FCBGA package. It provides a high-density programmable logic resource set suitable for systems that require substantial logic capacity, embedded memory, and a large number of I/O connections.
Designed for surface-mount assembly and rated for industrial operation, this device targets designs where integration of logic, on-chip memory, and extensive I/O in a single component reduces board complexity and supports robust operation across a wide temperature range.
Key Features
- Logic Capacity 221,184 logic elements for implementing complex digital functions and custom hardware architectures.
- Embedded Memory Approximately 7.8 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory.
- I/O Resources 640 user I/O pins to accommodate multiple interfaces and high-pin-count connectivity requirements.
- Package 1136-ball FCBGA (35 × 35 mm) package for high-density board integration and surface-mount assembly.
- Power Core supply voltage range from 0.95 V to 1.05 V to match system power architectures.
- Thermal and Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
- Compliance RoHS compliant for environmental and regulatory alignment.
Typical Applications
- Industrial Controls Implement custom control logic and real-time processing in industrial automation systems, leveraging the industrial temperature rating.
- High-Density I/O Systems Support board designs that require numerous parallel or serial interfaces with the device’s 640 I/O pins.
- Embedded Acceleration Offload compute-intensive kernels and custom data paths using the device’s large logic and embedded memory resources.
Unique Advantages
- High Logic Integration: 221,184 logic elements enable consolidation of multiple functions into a single FPGA, reducing component count.
- Substantial On-Chip Memory: Approximately 7.8 Mbits of embedded RAM minimizes dependence on external memory for buffering and local storage.
- Extensive I/O Capacity: 640 I/O pins provide flexibility for multi-protocol interfacing and high-channel-count designs.
- Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsher environments where thermal robustness is required.
- Compact FCBGA Package: 1136-ball (35 × 35 mm) surface-mount package balances density and thermal considerations for system-level integration.
- Regulatory Compliance: RoHS compliance aids in meeting environmental requirements for products and supply chains.
Why Choose XC5VLX220T-1FF1136I?
The XC5VLX220T-1FF1136I positions itself as a high-capacity, industrial-grade FPGA option for designs that require a large quantity of programmable logic, significant on-chip memory, and many I/O connections in a single surface-mount package. Its voltage and temperature specifications align with industrial system requirements, enabling reliable operation across a wide range of conditions.
This device is well suited to engineers and teams consolidating functions into a single FPGA to reduce BOM complexity, tighten integration, and meet the thermal and environmental demands of industrial applications. RoHS compliance further supports long-term product planning and regulatory alignment.
Request a quote or submit an inquiry for pricing and availability of the XC5VLX220T-1FF1136I to discuss suitability for your project and lead-time expectations.

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