XC5VLX220T-2FF1738I

The XC5VLX220T-2FF1738I is a Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC designed for industrial applications requiring high logic capacity and extensive I/O. It provides a combination of large on-chip memory, a high count of programmable logic elements, and an industrial operating temperature window to support robust embedded designs.

Key Features

• Core Logic Capacity  Provides 221,184 logic elements to implement large, complex digital designs.
• Embedded Memory  Includes approximately 7.8 Mbits of on-chip RAM to support buffering, FIFOs and local data storage requirements.
• I/O Density  Offers 680 general-purpose I/O pins to interface with multiple peripherals and high-pin-count systems.
• Package and Mounting  Available in a 1738-FCBGA (1738-BBGA) package with a 42.5 × 42.5 mm footprint and surface-mount construction for compact board integration.
• Power Supply  Core supply range of 950 mV to 1.05 V to match system power budgeting and design constraints.
• Temperature and Grade  Industrial-grade device rated for operation from −40°C to 100°C for deployment in temperature-challenging environments.
• Regulatory  RoHS compliant to support environmentally conscious designs.

Unique Advantages

• High logic integration: 221,184 logic elements reduce the need for multiple devices and simplify partitioning of large designs.
• Substantial on-chip memory: Approximately 7.8 Mbits of embedded RAM supports data-intensive functions without relying solely on external memory.
• Extensive external connectivity: 680 I/O pins provide flexibility for complex system interfaces and multi-channel designs.
• Industrial thermal range: Rated from −40°C to 100°C to maintain operation across a wide range of deployment conditions.
• Compact, industry-standard package: 1738-FCBGA (42.5 × 42.5 mm) surface-mount package enables dense PCB layouts while supporting high-pin-count routing.

Why Choose XC5VLX220T-2FF1738I?

The XC5VLX220T-2FF1738I is positioned for engineers and procurement teams needing a highly integrated FPGA solution that balances large logic capacity, meaningful on-chip memory, and a high I/O count in an industrial-grade package. Its specified core voltage range and surface-mount FCBGA footprint make it suitable for compact, high-density system designs that require reliable operation across a broad temperature range.

Choosing this device supports scalable, long-term designs where integration, connectivity and thermal robustness are important factors. The combination of logic, memory and I/O resources helps reduce system-level complexity and component count.

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