XC5VLX220T-1FFG1738C

IC FPGA 680 I/O 1738FCBGA
Part Description

Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 680 7815168 221184 1738-BBGA, FCBGA

Quantity 468 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1738-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1738-BBGA, FCBGANumber of I/O680Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs17280Number of Logic Elements/Cells221184
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7815168

Overview of XC5VLX220T-1FFG1738C – Virtex®-5 LXT Field Programmable Gate Array (FPGA)

The XC5VLX220T-1FFG1738C is a Virtex-5 LXT field programmable gate array (FPGA) IC from AMD, supplied in a 1738-ball FCBGA package. It delivers very large logic capacity and extensive I/O for complex, programmable digital designs in commercial-grade applications.

Designed for high-density integration, this surface-mount FPGA pairs 221,184 logic elements with substantial on-chip memory and a wide I/O complement, enabling implementation of complex custom logic, protocol bridging, and system orchestration within a compact FCBGA footprint.

Key Features

  • Core Architecture Virtex-5 LXT FPGA architecture in a high-pin-count FCBGA package tailored for large, programmable digital designs.
  • Logic Capacity 221,184 logic elements providing substantial resources for implementing complex state machines, datapaths, and control logic.
  • Embedded Memory Approximately 7.8 Mbits of on-chip RAM to support buffering, FIFOs, and intermediate data storage for large logic designs.
  • High I/O Count 680 I/O pins to support multiple parallel interfaces, wide buses, and extensive external device connectivity.
  • Power Supply Core voltage range of 950 mV to 1.05 V to match system power domains and maintain predictable operation within the specified supply window.
  • Package & Mounting 1738-ball FCBGA (42.5 × 42.5 mm) package, surface-mount for high-density PCB implementations.
  • Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for commercial-environment deployments.
  • RoHS Compliant Meets RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

  • Custom digital processing Implement large-scale programmable logic and control functions using 221,184 logic elements and on-chip memory for intermediate data storage.
  • Multi-interface bridging Support extensive external connectivity with 680 I/O pins, enabling protocol conversion and interface aggregation in a single device.
  • High-density integration Leverage the 1738-FCBGA package to consolidate complex subsystems onto a compact board footprint while maintaining high signal count.
  • Prototyping and system validation Use the FPGA’s large logic and memory resources to prototype and validate complex digital designs before production.

Unique Advantages

  • Substantial logic resources: 221,184 logic elements allow implementation of large-scale digital designs without partitioning across multiple devices.
  • Generous on-chip memory: Approximately 7.8 Mbits of embedded RAM reduces dependency on external memory for buffering and temporary storage.
  • Extensive I/O capability: 680 I/Os provide flexibility for multi-channel interfaces, wide buses, and mixed-signal system integration.
  • Compact high-pin package: 1738-ball FCBGA (42.5 × 42.5 mm) offers high integration density for board-level space savings.
  • Commercial-grade operation: Rated 0 °C to 85 °C for typical commercial deployment scenarios.
  • Environmental compliance: RoHS status compliant to support lead-free manufacturing processes.

Why Choose XC5VLX220T-1FFG1738C?

The XC5VLX220T-1FFG1738C positions itself as a high-capacity, commercially rated FPGA option for designs that require large programmable logic resources, significant on-chip memory, and a very high I/O count. Its 1738-ball FCBGA package enables dense system integration while the specified supply and temperature ranges support predictable operation in commercial environments.

This device is suitable for engineers and system designers looking to consolidate complex digital functions into a single programmable device, reduce external component count, and accelerate design iteration using a well-known Virtex-5 LXT architecture from AMD.

Request a quote to check availability, pricing, and lead time for the XC5VLX220T-1FFG1738C. Our team can provide the next steps for procurement and volume inquiries.

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