XC5VLX220-1FFG1760I

IC FPGA 800 I/O 1760FCBGA
Part Description

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 800 7077888 221184 1760-BBGA, FCBGA

Quantity 384 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O800Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs17280Number of Logic Elements/Cells221184
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7077888

Overview of XC5VLX220-1FFG1760I – Virtex®-5 LX Field Programmable Gate Array (FPGA)

The XC5VLX220-1FFG1760I is a Virtex®-5 LX field programmable gate array offered in a 1760-ball FCBGA package for surface-mount applications. It combines a large logic capacity with substantial on-chip memory and high I/O density to address industrial designs that require programmable logic, extensive interfacing, and reliable operation across a wide temperature range.

Key Features

  • Logic Capacity  Provides 221,184 logic elements for implementing large-scale custom logic, control paths, and parallel processing architectures.
  • Embedded Memory  Includes approximately 7 Mbits of on-chip RAM to support buffering, state storage, and tightly coupled data processing.
  • I/O Density  Offers 800 user I/O pins, enabling extensive interface integration and multiple peripheral connections within a single device.
  • Package & Mounting  Supplied in a 1760-FCBGA (42.5×42.5 mm) package designed for surface-mount assembly to support compact, high-density PCB layouts.
  • Power  Core voltage supply operates from 950 mV to 1.05 V, compatible with low-voltage FPGA power domains and system power budgeting.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature performance.
  • Regulatory  RoHS compliant for lead-free manufacturing and environmental compliance.

Typical Applications

  • Industrial control and automation  Large logic capacity and on-chip memory allow implementation of complex control algorithms, sequencing, and signal handling for industrial systems.
  • High-density I/O systems  With 800 I/O pins, the device supports multi-channel interface aggregation, protocol bridging, and extensive sensor or actuator connectivity.
  • Embedded prototyping and custom logic  High element count and embedded RAM make the device suitable for prototyping custom digital hardware and developing application-specific accelerators within an industrial form factor.

Unique Advantages

  • High logic integration: 221,184 logic elements reduce the need for multiple discrete CPLDs or FPGAs, simplifying system architecture.
  • Substantial on-chip memory: Approximately 7 Mbits of embedded RAM supports buffering and fast local data access without external memory in many use cases.
  • Extensive interfacing capability: 800 user I/Os enable consolidation of multiple interfaces and peripherals onto a single device.
  • Industrial-ready thermal range: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Compact, manufacturable package: 1760-FCBGA (42.5×42.5 mm) surface-mount package supports high-density board layouts and standard SMT assembly.
  • RoHS compliance: Facilitates integration into lead-free manufacturing processes and environmentally conscious product designs.

Why Choose XC5VLX220-1FFG1760I?

The XC5VLX220-1FFG1760I positions itself as a high-capacity, industrial-grade FPGA that combines large programmable logic resources, significant embedded memory, and very high I/O density in a compact FCBGA package. It is well suited for engineers developing industrial control systems, high-density interface modules, and advanced embedded prototypes that must operate across a wide temperature range.

Choosing this device supports designs that require consolidation of complex logic and multiple interfaces into a single component, helping to reduce system complexity and PCB real estate while meeting industrial operating requirements.

Request a quote or submit an inquiry to obtain pricing and availability information for the XC5VLX220-1FFG1760I.

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