XC5VLX220-1FFG1760I
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 800 7077888 221184 1760-BBGA, FCBGA |
|---|---|
| Quantity | 384 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 800 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 17280 | Number of Logic Elements/Cells | 221184 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7077888 |
Overview of XC5VLX220-1FFG1760I – Virtex®-5 LX Field Programmable Gate Array (FPGA)
The XC5VLX220-1FFG1760I is a Virtex®-5 LX field programmable gate array offered in a 1760-ball FCBGA package for surface-mount applications. It combines a large logic capacity with substantial on-chip memory and high I/O density to address industrial designs that require programmable logic, extensive interfacing, and reliable operation across a wide temperature range.
Key Features
- Logic Capacity Provides 221,184 logic elements for implementing large-scale custom logic, control paths, and parallel processing architectures.
- Embedded Memory Includes approximately 7 Mbits of on-chip RAM to support buffering, state storage, and tightly coupled data processing.
- I/O Density Offers 800 user I/O pins, enabling extensive interface integration and multiple peripheral connections within a single device.
- Package & Mounting Supplied in a 1760-FCBGA (42.5×42.5 mm) package designed for surface-mount assembly to support compact, high-density PCB layouts.
- Power Core voltage supply operates from 950 mV to 1.05 V, compatible with low-voltage FPGA power domains and system power budgeting.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature performance.
- Regulatory RoHS compliant for lead-free manufacturing and environmental compliance.
Typical Applications
- Industrial control and automation Large logic capacity and on-chip memory allow implementation of complex control algorithms, sequencing, and signal handling for industrial systems.
- High-density I/O systems With 800 I/O pins, the device supports multi-channel interface aggregation, protocol bridging, and extensive sensor or actuator connectivity.
- Embedded prototyping and custom logic High element count and embedded RAM make the device suitable for prototyping custom digital hardware and developing application-specific accelerators within an industrial form factor.
Unique Advantages
- High logic integration: 221,184 logic elements reduce the need for multiple discrete CPLDs or FPGAs, simplifying system architecture.
- Substantial on-chip memory: Approximately 7 Mbits of embedded RAM supports buffering and fast local data access without external memory in many use cases.
- Extensive interfacing capability: 800 user I/Os enable consolidation of multiple interfaces and peripherals onto a single device.
- Industrial-ready thermal range: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
- Compact, manufacturable package: 1760-FCBGA (42.5×42.5 mm) surface-mount package supports high-density board layouts and standard SMT assembly.
- RoHS compliance: Facilitates integration into lead-free manufacturing processes and environmentally conscious product designs.
Why Choose XC5VLX220-1FFG1760I?
The XC5VLX220-1FFG1760I positions itself as a high-capacity, industrial-grade FPGA that combines large programmable logic resources, significant embedded memory, and very high I/O density in a compact FCBGA package. It is well suited for engineers developing industrial control systems, high-density interface modules, and advanced embedded prototypes that must operate across a wide temperature range.
Choosing this device supports designs that require consolidation of complex logic and multiple interfaces into a single component, helping to reduce system complexity and PCB real estate while meeting industrial operating requirements.
Request a quote or submit an inquiry to obtain pricing and availability information for the XC5VLX220-1FFG1760I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








