XC5VLX155T-2FF1136I
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 640 7815168 155648 1136-BBGA, FCBGA |
|---|---|
| Quantity | 1,027 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1136-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1136-BBGA, FCBGA | Number of I/O | 640 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 12160 | Number of Logic Elements/Cells | 155648 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7815168 |
Overview of XC5VLX155T-2FF1136I – Virtex®-5 LXT FPGA, 155,648 Logic Elements, 1136‑FCBGA
The XC5VLX155T-2FF1136I is a Virtex®-5 LXT field programmable gate array (FPGA) from AMD, offering high logic density and substantial on-chip memory in an industrial-grade, surface-mount package. It addresses designs that require large logic capacity, significant embedded RAM, and a wide operating temperature range.
Key technical attributes include 155,648 logic elements, approximately 7.82 Mbits of embedded memory, 640 user I/O, and an 1136‑FCBGA (35×35) package, making it suitable for robust industrial applications that require extensive programmable logic and interfacing capability.
Key Features
- Logic Capacity 155,648 logic elements providing high-density programmable logic resources for complex digital designs; includes 12,160 CLBs for structured logic implementation.
- Embedded Memory Approximately 7.82 Mbits of on-chip RAM (7,815,168 bits) to support data buffering, state storage, and local memory needs without immediate reliance on external memory.
- I/O and Package 640 user I/O pins in a compact 1136‑FCBGA supplier device package (35×35), enabling extensive peripheral and bus connectivity while minimizing PCB footprint.
- Power Core voltage supply range of 950 mV to 1.05 V to match system power architectures that require low-voltage FPGA cores.
- Thermal and Mounting Industrial operating temperature range of −40 °C to 100 °C and surface-mount package type for deployment in demanding environments.
- Compliance RoHS compliant construction suitable for modern regulatory requirements.
Typical Applications
- Industrial control systems Use the FPGA's industrial temperature rating and high logic density for custom control algorithms and real-time processing in harsh environments.
- High-density I/O interfaces Leverage 640 user I/Os to consolidate multiple peripheral interfaces and complex bus logic into a single programmable device.
- Embedded memory–dependent designs Take advantage of approximately 7.82 Mbits of on-chip RAM for buffering, packet handling, or state machines without extensive external memory.
Unique Advantages
- High logic integration: 155,648 logic elements reduce the need for multiple discrete logic devices and simplify board-level design.
- Substantial on-chip RAM: Approximately 7.82 Mbits of embedded memory minimizes external memory dependency and lowers system BOM complexity.
- Extensive I/O count: 640 user I/Os enable broad peripheral connectivity and flexible interface consolidation on a single device.
- Industrial-grade operation: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
- Compact, manufacturable package: 1136‑FCBGA (35×35) surface-mount package supports high-density board layouts and automated assembly processes.
- Regulatory compliance: RoHS compliant to meet environmental material requirements.
Why Choose XC5VLX155T-2FF1136I?
The XC5VLX155T-2FF1136I delivers a combination of high logic capacity, significant embedded memory, and a large I/O count in an industrial-grade Virtex‑5 LXT FPGA package from AMD. It is positioned for designers who need dense programmable logic and robust thermal performance for industrial or other demanding applications.
This part is well suited to development teams building complex custom digital systems that benefit from on-chip memory, extensive interfacing, and the reliability expectations associated with industrial-grade components. The result is a scalable, integrated solution that can simplify board design and support long-term deployment needs.
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