XC5VLX155T-1FFG1136I

The XC5VLX155T-1FFG1136I is a Virtex®-5 LXT FPGA from AMD supplied in a 1136-ball FCBGA package. It provides a high logic capacity FPGA fabric with substantial embedded memory and a large I/O complement for demanding, programmable digital designs.

Key differentiators visible in the datasheet entry include 155,648 logic elements, approximately 7.8 Mbits of embedded RAM, 640 I/O pins, industrial-grade operating range, and a low-voltage core supply requirement of 0.95–1.05 V—features that support dense, I/O-rich implementations in surface-mount designs.

Key Features

• Core Logic — 155,648 logic elements to implement complex programmable logic and large-scale digital functions.
• Embedded Memory — Approximately 7.8 Mbits of on-chip RAM to support buffering, FIFOs, and distributed storage for application logic.
• I/O Capacity — 640 user I/O pins enabling extensive external interfacing and parallel connections.
• Power — Core voltage supply range of 0.95 V to 1.05 V for the device core.
• Package — 1136-ball BGA (1136-FCBGA, 35×35) surface-mount package for compact, high-density board integration.
• Temperature & Grade — Industrial grade with an operating range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density digital processing systems — Large logic capacity and embedded RAM support complex signal processing and algorithm implementation.
• I/O-intensive interfaces — 640 I/O pins accommodate wide parallel buses, multi-channel interfaces, and extensive sensor/actuator connectivity.
• Industrial control and automation — Industrial-grade temperature range and surface-mount package suitability for embedded industrial electronics.

Unique Advantages

• High logic integration: 155,648 logic elements enable consolidation of multiple functions into a single FPGA, reducing external component count.
• Substantial on-chip memory: Approximately 7.8 Mbits of embedded RAM supports local buffering and state storage without added external memory.
• Large I/O count: 640 I/O pins provide flexibility for parallel interfaces and multi-channel system designs.
• Industrial thermal capability: Rated from −40 °C to 100 °C to meet temperature requirements for industrial deployments.
• Compact FCBGA package: 1136-ball (35×35) FCBGA offers high pin density in a surface-mount form factor for space-constrained PCBs.
• RoHS compliant: Meets environmental compliance requirements for lead-free assembly.

Why Choose XC5VLX155T-1FFG1136I?

The XC5VLX155T-1FFG1136I positions itself as a high-capacity, industrial-grade Virtex®-5 LXT FPGA suitable for designs that require dense programmable logic, significant on-chip RAM, and extensive I/O. Its 1136-ball FCBGA package and surface-mount mounting make it appropriate for compact, production boards where board space and pin count matter.

Produced by AMD and offered with RoHS compliance, this device is aimed at engineers and integrators seeking a scalable, high-density FPGA building block for complex digital systems operating across a broad industrial temperature range.

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