XC5VLX155T-1FF1136C

The XC5VLX155T-1FF1136C is a Virtex®-5 LXT field programmable gate array (FPGA) IC from AMD, provided in a 1136-ball FCBGA package. It delivers substantial on-chip resources for complex digital designs, including 155,648 logic elements and approximately 7.8 Mbits of embedded memory.

With 640 I/O pins, surface-mount packaging, and a commercial operating range, this device is suited to board-level integration where large logic capacity, significant embedded memory and high I/O density are required.

Key Features

• Core Logic Capacity — 155,648 logic elements (cells) provide a large fabric for implementing complex digital functions and custom logic architectures.
• Embedded Memory — Total on-chip RAM of 7,815,168 bits (approximately 7.8 Mbits) to support buffering, data processing and state storage requirements.
• I/O Density — 640 available I/O pins to accommodate high-channel interfacing and multi-device connectivity without extensive external multiplexing.
• Package & Mounting — Provided in a 1136-BBGA / 1136-FCBGA package (35×35), designed for surface-mount board assembly.
• Power Supply — Core voltage range of 950 mV to 1.05 V, allowing integration with standard FPGA power delivery schemes.
• Operating Temperature — Commercial-grade operating range from 0 °C to 85 °C suitable for standard commercial environments.
• Environmental Compliance — RoHS compliant, addressing lead-free and restricted substance requirements for many assemblies.

Typical Applications

• Custom Digital Logic and Prototyping — Use the large logic element count to implement and iterate complex logic designs and prototypes on a single device.
• Memory-Intensive Functions — Approximately 7.8 Mbits of embedded RAM supports buffering, packet processing and data staging within the FPGA fabric.
• High-Density I/O Systems — 640 I/O pins enable multi-channel interfaces, parallel buses and extensive peripheral connectivity at the board level.

Unique Advantages

• High Integration of Logic and Memory: Combines 155,648 logic elements with approximately 7.8 Mbits of on-chip RAM to reduce external component count and simplify system design.
• Large I/O Count: 640 I/Os reduce the need for external multiplexers or multiple devices when implementing multi-channel interfaces.
• Surface-Mount FCBGA Package: 1136-ball FCBGA (35×35) supports compact board layout and high-density system integration.
• Commercial Temperature Range: Rated 0 °C to 85 °C for deployments in standard commercial environments.
• RoHS Compliant: Meets common environmental and regulatory requirements for lead-free assembly.
• Controlled Core Voltage Range: Operates within a defined 950 mV to 1.05 V supply window for predictable power design.

Why Choose XC5VLX155T-1FF1136C?

The XC5VLX155T-1FF1136C positions itself as a high-capacity Virtex-5 LXT FPGA option for designs that require extensive logic resources, significant embedded memory and a high number of I/Os in a compact surface-mount package. Its commercial-grade operating range and RoHS compliance make it appropriate for a wide range of board-level applications.

This device is well suited for engineering teams and procurement groups targeting solutions that need large on-chip logic and memory capacity, high I/O density, and a standardized FCBGA form factor for streamlined integration and assembly.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XC5VLX155T-1FF1136C.