XC5VLX50T-2FF1136C

The XC5VLX50T-2FF1136C is a Virtex®-5 LXT Field Programmable Gate Array from AMD supplied in an FCBGA package. It provides a balance of on-chip logic, embedded memory, and a high count of user I/O for reconfigurable digital designs.

Key capabilities include 46,080 logic elements, approximately 2.21 Mbits of embedded memory, and 480 user I/O, making it suitable for designs that require sustained on-chip resources within a commercial temperature range.

Key Features

• FPGA Core Virtex-5 LXT architecture in the XC5VLX50T-2FF1136C package from AMD, optimized for reconfigurable logic implementations.
• Logic Capacity 46,080 logic elements to implement complex combinational and sequential logic directly on-chip.
• Embedded Memory Approximately 2.21 Mbits of on-chip RAM (2,211,840 bits) for data buffering, FIFOs and local storage.
• User I/O 480 user I/O pins to support multiple external interfaces and parallel connections.
• Power Core voltage supply range of 0.95 V to 1.05 V for core power planning and supply selection.
• Package & Mounting Supplied in a 1136-FCBGA (35x35) package; package case listed as 1136-BBGA, FCBGA. Surface mount device for PCB assembly.
• Environmental & Grade Commercial grade device with operating temperature range 0 °C to 85 °C and RoHS-compliant status.

Typical Applications

• Logic-dense designs Uses the 46,080 logic elements to realize substantial custom logic and control functions on a single device.
• I/O-intensive systems 480 user I/O support multiple parallel interfaces, peripheral aggregation, and board-level connectivity.
• Embedded memory requirements Approximately 2.21 Mbits of on-chip RAM for local buffering, packet storage and small data sets.
• Compact, surface-mounted boards 1136-FCBGA (35x35) package supports high-density, surface-mount PCB implementations.

Unique Advantages

• Substantial on-chip logic: 46,080 logic elements enable large-scale custom logic implementations without immediately resorting to multiple devices.
• Integrated memory: Approximately 2.21 Mbits of embedded RAM reduces external memory needs for buffering and control data.
• High I/O count: 480 user I/O simplifies interfacing to a wide range of external components and parallel buses.
• Board-level form factor: 1136-FCBGA (35x35) packaging provides a compact footprint for high-density PCB layouts.
• Commercial temperature and RoHS compliance: Operates across 0 °C to 85 °C and meets RoHS requirements for regulatory alignment.

Why Choose XC5VLX50T-2FF1136C?

The XC5VLX50T-2FF1136C combines a sizable logic fabric with embedded memory and a large I/O complement in a compact FCBGA package. Its electrical and thermal specifications—0.95 V to 1.05 V core supply and 0 °C to 85 °C operating range—align with commercial embedded system requirements.

This device is appropriate for designers and procurement teams seeking a reconfigurable solution that offers on-chip resources to reduce external BOM, supports extensive interfacing, and fits surface-mount, high-density board designs while maintaining RoHS compliance.

Request a quote or submit a pricing and availability inquiry to receive lead-time and procurement details for the XC5VLX50T-2FF1136C.