XC5VLX50T-1FFG665CES

The XC5VLX50T-1FFG665CES is a Virtex‑5 LXT field programmable gate array (FPGA) device from AMD, provided in a 665‑FBGA FCBGA package. It delivers a high-density programmable fabric with substantial on-chip memory and a large I/O count for commercial electronic designs that require flexible, reconfigurable logic.

Key Features

• Programmable Logic: 46,080 logic elements provide a high-density resource pool for implementing custom digital functions and state machines.
• Embedded Memory: Approximately 2.2 Mbits of on-chip RAM (2,211,840 bits) for buffering, FIFOs, and small lookup tables to support complex logic implementations.
• I/O Capability: 360 general-purpose I/O pins to support wide parallel interfaces, multiple peripherals, and board-level connectivity.
• Power Supply Range: Device core supply specification from 950 mV to 1.05 V to match system power-rail designs and voltage planning.
• Package and Mounting: 665‑FCBGA package (27 × 27 mm) in a surface-mount format for compact board integration and high pin density.
• Operating Grade and Temperature: Commercial grade with an operating temperature range of 0°C to 85°C suitable for commercial electronic products.
• Regulatory Compliance: RoHS compliant to meet environmental requirements for lead-free assembly.

Typical Applications

• Commercial Embedded Systems: Implement custom control logic, protocol handling, and glue logic in commercial products that require reprogrammable hardware.
• Prototyping and Development: Use the device for validation of custom digital designs and hardware acceleration in lab and development environments.
• I/O-Intensive Interfaces: Deploy in designs that need a large number of parallel I/Os for board-level interconnects, sensors, or external peripherals.

Unique Advantages

• High Logic Density: 46,080 logic elements allow consolidation of multiple functions into a single device, reducing overall system component count.
• Substantial On-Chip Memory: Approximately 2.2 Mbits of embedded RAM enables local buffering and data handling without external memory for many use cases.
• Extensive I/O Count: 360 I/O pins provide flexibility for interfacing to a wide range of peripherals and external devices.
• Compact, High-Pin Package: 665‑FCBGA (27 × 27 mm) supports high pin density in a compact footprint for space-constrained boards.
• Commercial Temperature Suitability: Rated for 0°C to 85°C, aligning with standard commercial application requirements.
• RoHS Compliant: Facilitates lead-free manufacturing and simplifies environmental compliance for product assemblies.

Why Choose XC5VLX50T-1FFG665CES?

The XC5VLX50T-1FFG665CES positions itself as a commercial-grade, high-density FPGA option combining 46,080 logic elements, approximately 2.2 Mbits of embedded memory, and 360 I/Os in a compact 665‑FCBGA package. This combination delivers the integration needed to consolidate discrete logic and memory functions onto a single programmable device.

It is well suited for designers building commercial embedded systems, prototypes, and I/O-heavy applications that benefit from reconfigurable hardware, substantial on-chip memory, and a high pin count. The device’s commercial operating range and RoHS compliance support mainstream product development and manufacturing requirements.

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