XC5VLX50T-1FFG1136I

IC FPGA 480 I/O 1136FCBGA
Part Description

Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 480 2211840 46080 1136-BBGA, FCBGA

Quantity 1,062 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1136-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1136-BBGA, FCBGANumber of I/O480Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs3600Number of Logic Elements/Cells46080
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2211840

Overview of XC5VLX50T-1FFG1136I – Virtex®-5 LXT Field Programmable Gate Array (FPGA)

The XC5VLX50T-1FFG1136I is a Virtex®-5 LXT field programmable gate array (FPGA) IC supplied in a 1136-ball FCBGA package. It provides a combination of configurable logic, embedded memory, and a high I/O count for demanding digital designs.

Key device attributes include 3,600 configurable logic blocks (CLBs) representing 46,080 logic elements, approximately 2.21 Mbits of on-chip RAM, 480 I/O pins, a 1136-FCBGA (35×35) package, a core voltage supply range of 0.95 V to 1.05 V, and an industrial operating temperature range of −40 °C to 100 °C. The device is RoHS compliant and designed for surface-mount assembly.

Key Features

  • Core Logic 3,600 configurable logic blocks (CLBs) and 46,080 logic elements for implementing complex programmable logic functions.
  • Embedded Memory Approximately 2.21 Mbits of on-chip RAM to support buffering, state storage and memory-intensive logic tasks.
  • I/O Count 480 I/O pins to accommodate broad parallel interfacing and multiple external connections.
  • Power Core voltage supply range of 0.95 V to 1.05 V for compatible power-rail designs.
  • Package and Mounting 1136-FCBGA package (35×35 mm) in a surface-mount form factor for board-level integration.
  • Temperature and Grade Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Unique Advantages

  • High logic density: 46,080 logic elements provide substantial capacity for complex, feature-rich designs.
  • Substantial embedded memory: Approximately 2.21 Mbits of on-chip RAM supports large buffers and stateful processing without external memory.
  • Extensive I/O capability: 480 I/O pins enable multiple parallel interfaces and broad connectivity options on a single device.
  • Industrial temperature range: −40 °C to 100 °C rating supports operation in extended-temperature applications.
  • Compact FCBGA packaging: 1136-ball FCBGA (35×35) balances high pin count with a compact board footprint for system integration.
  • RoHS compliant: Meets common environmental manufacturing directives for lead-free production.

Why Choose XC5VLX50T-1FFG1136I?

The XC5VLX50T-1FFG1136I delivers a combination of high logic capacity, significant embedded memory and a large I/O complement in an industrial-grade FPGA package. Its specifications suit designs that require on-chip resources for complex logic, sizable memory buffers and numerous interfaces while operating across a wide temperature range.

Engineers selecting this device gain a programmable platform that integrates core logic, embedded RAM and abundant I/O in a surface-mount 1136-FCBGA package, making it appropriate for designs demanding high-density programmable logic within industrial operating conditions.

If you would like pricing or availability, request a quote or submit an inquiry to receive a formal sales response for the XC5VLX50T-1FFG1136I.

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