XC5VLX50T-1FF665I
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 360 2211840 46080 665-BBGA, FCBGA |
|---|---|
| Quantity | 819 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 665-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 665-BBGA, FCBGA | Number of I/O | 360 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 3600 | Number of Logic Elements/Cells | 46080 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2211840 |
Overview of XC5VLX50T-1FF665I – Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC
The XC5VLX50T-1FF665I is a Virtex®-5 LXT FPGA in a 665-ball FCBGA package, supplied as a surface-mount device and rated for industrial use. It combines sizable logic capacity, embedded memory, and a high count of I/O pins to address designs that require on-chip programmable logic and dense I/O integration.
Key electrical and environmental characteristics include a supply range from 950 mV to 1.05 V and an operating temperature range of −40°C to 100°C, supporting deployment in temperature-challenging industrial environments.
Key Features
- Logic Capacity 46,080 logic elements provide substantial programmable logic resources for complex custom digital functions.
- Embedded Memory Approximately 2.2 Mbits of on-chip RAM (2,211,840 bits) enable local buffering and data storage for algorithms and state machines.
- I/O Density 360 user I/O pins support wide parallel interfaces and multiple peripheral connections in a single device.
- Package & Mounting 665-FCBGA (27×27) package, also referenced as 665-BBGA/FCBGA, in a surface-mount form factor for compact board-level integration.
- Power Supply Operates with a core supply range of 950 mV to 1.05 V to match system power rails and design constraints.
- Industrial Temperature Grade Rated for −40°C to 100°C operation, suitable for industrial applications that require extended temperature capability.
- Device Scale 3600 CLBs supporting the device’s logic element count, enabling scalable logic partitioning within designs.
- RoHS Compliance Device is RoHS compliant, facilitating use in assemblies requiring restricted substance compliance.
Typical Applications
- I/O-Intensive Systems Designs that require many parallel interfaces or mixed I/O signal sets can leverage the device’s 360 user I/Os for connectivity consolidation.
- High-Density Logic Implementations Applications needing tens of thousands of logic elements can use the 46,080 logic elements for custom digital processing and control logic.
- Embedded Memory-Dependent Functions Algorithms and functions that need on-chip buffering or local data storage benefit from approximately 2.2 Mbits of embedded RAM.
- Industrial-Grade Equipment Systems operating across −40°C to 100°C can take advantage of the device’s industrial temperature rating and surface-mount 665-FCBGA package for board-level integration.
Unique Advantages
- High Logic Density: 46,080 logic elements provide substantial on-chip compute resources, reducing the need for multiple discrete devices.
- Significant Embedded Memory: Approximately 2.2 Mbits of on-chip RAM lowers external memory dependence for buffering and intermediate storage.
- Extensive I/O Count: 360 user I/Os enable broad peripheral and parallel interface support without additional I/O expanders.
- Industrial Temperature Capability: −40°C to 100°C rating supports deployment in temperature-challenging industrial environments.
- Compact, Surface-Mount Package: The 665-FCBGA (27×27) package allows dense board layouts while maintaining robust device connectivity.
- Controlled Core Voltage Range: Operation from 950 mV to 1.05 V aligns with common core supply schemes for modern FPGA systems.
Why Choose XC5VLX50T-1FF665I?
The XC5VLX50T-1FF665I positions itself as a capable programmable logic option where high logic capacity, substantial on-chip memory, and dense I/O are required in an industrial-grade, surface-mount package. Its combination of 46,080 logic elements, approximately 2.2 Mbits of embedded RAM, and 360 I/Os makes it suitable for designs that need consolidated programmable functions and local data handling.
For engineers and procurement teams designing or sourcing devices for industrial systems, the XC5VLX50T-1FF665I offers a balanced mix of integration and environmental robustness, helping streamline board-level design while meeting temperature and packaging constraints.
Request a quote or submit a quote inquiry to receive pricing and availability information for the XC5VLX50T-1FF665I. Our team can help evaluate fit for your specific design requirements.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








