XC5VLX50T-1FF665I

IC FPGA 360 I/O 665FCBGA
Part Description

Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 360 2211840 46080 665-BBGA, FCBGA

Quantity 819 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package665-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case665-BBGA, FCBGANumber of I/O360Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs3600Number of Logic Elements/Cells46080
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2211840

Overview of XC5VLX50T-1FF665I – Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC

The XC5VLX50T-1FF665I is a Virtex®-5 LXT FPGA in a 665-ball FCBGA package, supplied as a surface-mount device and rated for industrial use. It combines sizable logic capacity, embedded memory, and a high count of I/O pins to address designs that require on-chip programmable logic and dense I/O integration.

Key electrical and environmental characteristics include a supply range from 950 mV to 1.05 V and an operating temperature range of −40°C to 100°C, supporting deployment in temperature-challenging industrial environments.

Key Features

  • Logic Capacity  46,080 logic elements provide substantial programmable logic resources for complex custom digital functions.
  • Embedded Memory  Approximately 2.2 Mbits of on-chip RAM (2,211,840 bits) enable local buffering and data storage for algorithms and state machines.
  • I/O Density  360 user I/O pins support wide parallel interfaces and multiple peripheral connections in a single device.
  • Package & Mounting  665-FCBGA (27×27) package, also referenced as 665-BBGA/FCBGA, in a surface-mount form factor for compact board-level integration.
  • Power Supply  Operates with a core supply range of 950 mV to 1.05 V to match system power rails and design constraints.
  • Industrial Temperature Grade  Rated for −40°C to 100°C operation, suitable for industrial applications that require extended temperature capability.
  • Device Scale  3600 CLBs supporting the device’s logic element count, enabling scalable logic partitioning within designs.
  • RoHS Compliance  Device is RoHS compliant, facilitating use in assemblies requiring restricted substance compliance.

Typical Applications

  • I/O-Intensive Systems  Designs that require many parallel interfaces or mixed I/O signal sets can leverage the device’s 360 user I/Os for connectivity consolidation.
  • High-Density Logic Implementations  Applications needing tens of thousands of logic elements can use the 46,080 logic elements for custom digital processing and control logic.
  • Embedded Memory-Dependent Functions  Algorithms and functions that need on-chip buffering or local data storage benefit from approximately 2.2 Mbits of embedded RAM.
  • Industrial-Grade Equipment  Systems operating across −40°C to 100°C can take advantage of the device’s industrial temperature rating and surface-mount 665-FCBGA package for board-level integration.

Unique Advantages

  • High Logic Density: 46,080 logic elements provide substantial on-chip compute resources, reducing the need for multiple discrete devices.
  • Significant Embedded Memory: Approximately 2.2 Mbits of on-chip RAM lowers external memory dependence for buffering and intermediate storage.
  • Extensive I/O Count: 360 user I/Os enable broad peripheral and parallel interface support without additional I/O expanders.
  • Industrial Temperature Capability: −40°C to 100°C rating supports deployment in temperature-challenging industrial environments.
  • Compact, Surface-Mount Package: The 665-FCBGA (27×27) package allows dense board layouts while maintaining robust device connectivity.
  • Controlled Core Voltage Range: Operation from 950 mV to 1.05 V aligns with common core supply schemes for modern FPGA systems.

Why Choose XC5VLX50T-1FF665I?

The XC5VLX50T-1FF665I positions itself as a capable programmable logic option where high logic capacity, substantial on-chip memory, and dense I/O are required in an industrial-grade, surface-mount package. Its combination of 46,080 logic elements, approximately 2.2 Mbits of embedded RAM, and 360 I/Os makes it suitable for designs that need consolidated programmable functions and local data handling.

For engineers and procurement teams designing or sourcing devices for industrial systems, the XC5VLX50T-1FF665I offers a balanced mix of integration and environmental robustness, helping streamline board-level design while meeting temperature and packaging constraints.

Request a quote or submit a quote inquiry to receive pricing and availability information for the XC5VLX50T-1FF665I. Our team can help evaluate fit for your specific design requirements.

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