XC5VLX50-3FFG676C

The XC5VLX50-3FFG676C is a Virtex®-5 LX field programmable gate array (FPGA) supplied in a 676-ball FCBGA package. It provides a high-density programmable logic platform with substantial on-chip memory and a large I/O count for commercial-grade embedded and system designs.

With 46,080 logic elements across 3,600 configurable logic blocks (CLBs), approximately 1.77 Mbits of embedded memory, and 440 I/O pins, this device is suited to designs that require significant logic capacity, broad connectivity, and compact surface-mount packaging.

Key Features

• Logic Capacity — 3,600 CLBs and 46,080 logic elements provide substantial programmable logic resources for implementing complex digital functions and custom processing pipelines.
• Embedded Memory — Approximately 1.77 Mbits (1,769,472 bits) of on-chip RAM supports buffering, lookup tables, and small data stores without external memory.
• I/O Density — 440 user I/O pins enable broad connectivity for high-pin-count interfaces and multi-channel systems.
• Power Supply — Core voltage range of 0.95 V to 1.05 V, allowing designers to plan power delivery and sequencing in line with system requirements.
• Package & Mounting — 676-ball BGA (676-FCBGA, 27×27) in a surface-mount format for compact PCB integration and high-density board layouts.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
• Regulatory Compliance — RoHS compliant for material and environmental considerations in manufacturing.

Typical Applications

• High-density digital processing — Implement complex logic, custom datapaths, and parallel processing functions using the device's large logic element count and CLB resources.
• Multi‑interface systems — Support systems requiring many external connections with 440 I/O pins for peripherals, buses, and interface bridging.
• Embedded memory‑centric designs — Use approximately 1.77 Mbits of on-chip RAM for buffering, lookup tables, and small data caches without immediate need for external RAM.

Unique Advantages

• Substantial on-chip logic: 46,080 logic elements deliver the capacity needed to consolidate multiple functions into a single FPGA, reducing component count.
• High I/O count: 440 I/O pins enable dense connectivity for systems with numerous sensors, interfaces, or channelized signals.
• Compact surface-mount BGA: The 676-FCBGA (27×27) package supports compact PCB layouts while maintaining routeability for high-pin-count designs.
• Commercial-grade operation: Rated for 0 °C to 85 °C, suitable for standard commercial environments and deployments.
• RoHS compliant: Material compliance helps streamline manufacturing and regulatory considerations.

Why Choose XC5VLX50-3FFG676C?

The XC5VLX50-3FFG676C combines a large pool of logic elements, meaningful embedded memory, and a high I/O count in a compact 676-ball FCBGA package, making it a practical choice for designers who need to integrate significant programmable logic and connectivity into space-constrained commercial systems. Its 0.95–1.05 V core supply range and commercial temperature rating align with standard design and manufacturing flows.

Choose this device when your design requires scalable logic capacity, on-chip memory for internal data handling, and substantial I/O capability within a surface-mount BGA form factor.

Request a quote or submit an inquiry to check availability and pricing for the XC5VLX50-3FFG676C. Our team can provide details to support procurement and design planning.