XC5VLX50-2FFG676I

The XC5VLX50-2FFG676I is a Virtex-5 LX field programmable gate array (FPGA) from AMD offered in a 676-ball FCBGA package. It provides 46,080 logic elements, approximately 1.77 Mbits of embedded memory and up to 440 user I/Os, targeted for industrial applications that require configurable logic capacity and high I/O density.

This device supports core supply voltages from 0.95 V to 1.05 V and is specified for operation from -40 °C to 100 °C, making it suitable for industrial temperature environments while maintaining a surface-mount 676-FCBGA (27×27) package footprint.

Key Features

• Core Logic – 46,080 logic elements provide significant programmable logic capacity for implementing custom digital functions and state machines.
• Embedded Memory – Approximately 1.77 Mbits of on-chip RAM to support data buffering, FIFOs and on-device storage for logic functions.
• I/O Density – 440 user I/Os enable extensive external connectivity and interface consolidation in system designs.
• Power – Core voltage supply specified from 0.95 V to 1.05 V to match system power-rail requirements.
• Package & Mounting – 676-FCBGA (27×27) package with surface-mount mounting type for compact board-level integration.
• Industrial Temperature Range – Rated for operation from -40 °C to 100 °C, suitable for industrial-environment deployments.
• RoHS Compliant – Device is compliant with RoHS environmental requirements.

Typical Applications

• Industrial Control & Automation – Use the device’s logic capacity and 440 I/Os to implement custom control logic, signal aggregation, and real-time interfacing in industrial systems.
• Networking & Communications – Leverage high I/O count and on-chip memory for protocol handling, packet buffering and custom data-paths.
• Custom Embedded Systems – Implement application-specific accelerators, glue logic and peripheral interfaces where reconfigurable logic and embedded memory are required.

Unique Advantages

• Substantial Logic Capacity: 46,080 logic elements enable complex designs and multiple concurrent hardware functions on a single device.
• Significant On‑Chip Memory: Approximately 1.77 Mbits of embedded RAM reduces dependency on external memory for buffering and temporary storage.
• High I/O Count: 440 user I/Os simplify system integration by supporting many external interfaces without additional I/O expanders.
• Industrial Temperature Operation: Rated from -40 °C to 100 °C to meet environmental demands of industrial deployments.
• Compact FCBGA Package: 676-ball FCBGA (27×27) provides a high-density, surface-mount footprint for space-constrained boards.
• RoHS Compliance: Environmentally compliant manufacturing and materials.

Why Choose XC5VLX50-2FFG676I?

The XC5VLX50-2FFG676I combines a large logic fabric, substantial embedded memory and a high I/O count in a compact 676-FCBGA package, making it well-suited for industrial applications that require configurable hardware and dense external connectivity. Its specified core voltage range and -40 °C to 100 °C operating temperature support integration into industrial systems with defined power and thermal envelopes.

Choose this device when your design needs a balance of logic capacity, on-chip memory and I/O resources in an industrial-grade FPGA form factor, backed by AMD’s Virtex-5 family product definition.

Request a quote or submit an inquiry to receive pricing and availability information for the XC5VLX50-2FFG676I.