XC5VLX50-2FFG324I

IC FPGA 220 I/O 324FCBGA
Part Description

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 220 1769472 46080 324-BBGA, FCBGA

Quantity 780 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package324-FCBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-BBGA, FCBGANumber of I/O220Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs3600Number of Logic Elements/Cells46080
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1769472

Overview of XC5VLX50-2FFG324I – Virtex®-5 LX Field Programmable Gate Array (FPGA) IC, 324-FCBGA (19×19), Industrial

The XC5VLX50-2FFG324I is a Virtex®-5 LX Field Programmable Gate Array from AMD that integrates a large programmable fabric with substantial on-chip memory and a high I/O count. Key device parameters include 46,080 logic elements, approximately 1.77 Mbits of embedded memory, and 220 user I/O pins, all in a 324-FCBGA surface-mount package.

Specified for industrial operation from -40°C to 100°C and RoHS compliant, this device targets designs that require a balance of logic density, embedded RAM, and interface flexibility within a compact ball-grid package.

Key Features

  • Logic Capacity 46,080 logic elements provide programmable fabric for implementing large or complex digital logic functions.
  • Embedded Memory Approximately 1.77 Mbits of on-chip RAM (1,769,472 bits) for internal data buffering, state storage, and memory-mapped logic structures.
  • I/O Density 220 user I/O pins to support multiple parallel interfaces and flexible board-level connectivity.
  • Power Supply Core voltage supply range of 0.95 V to 1.05 V for the device core rail, enabling defined power design and sequencing.
  • Package & Mounting 324-FCBGA (19×19) / 324-BBGA surface-mount package providing a compact footprint for high-density board layouts.
  • Industrial Temperature & Compliance Rated for operation from -40°C to 100°C and RoHS compliant; grade listed as Industrial.

Unique Advantages

  • Significant logic resources: 46,080 logic elements allow implementation of sizable digital subsystems without immediate partitioning across multiple devices.
  • Substantial on-chip RAM: Approximately 1.77 Mbits of embedded memory supports buffering, lookup tables, and state machines directly on the FPGA fabric.
  • High I/O count: 220 I/O pins enable flexible interfacing to peripherals, sensors, and parallel bus systems without external GPIO expanders.
  • Compact board-level footprint: 324-FCBGA (19×19) surface-mount package reduces PCB area compared with larger discrete solutions.
  • Industrial operating range: -40°C to 100°C rating supports deployment in temperature-challenging environments typical of industrial applications.
  • Regulatory readiness: RoHS compliance eases integration into assemblies requiring lead-free components.

Why Choose XC5VLX50-2FFG324I?

The XC5VLX50-2FFG324I combines a high count of logic elements, meaningful on-chip RAM, and broad I/O capability in a compact 324-FCBGA package, making it well-suited for industrial designs that need substantial programmable resources within a constrained board area. Its specified core voltage range and industrial temperature rating provide clear electrical and environmental boundaries for system-level power and thermal design.

As a member of the Virtex®-5 LX family from AMD, this device offers a defined set of hardware resources for engineers and procurement teams seeking a programmable logic solution with verified specifications for logic density, memory, I/O, packaging, and compliance.

Request a quote or submit an inquiry for availability and pricing to begin procurement of XC5VLX50-2FFG324I units for your next design.

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