XC5VLX50-2FFG1153I

The XC5VLX50-2FFG1153I is a Virtex®-5 LX field programmable gate array delivered in a 1153-ball FCBGA package. It combines high logic capacity, a large I/O count and embedded RAM to address demanding industrial applications that require dense, reprogrammable digital logic.

With 46,080 logic elements, approximately 1.77 Mbits of on-chip RAM and 560 user I/O, this FPGA is positioned for designs that need substantial I/O connectivity and local memory while operating across industrial temperature and core-voltage ranges.

Key Features

• Logic Capacity — 46,080 logic elements provide substantial programmable logic resources for implementing complex state machines, datapaths and custom compute blocks.
• Embedded Memory — Approximately 1.77 Mbits of on-chip RAM for local buffering, FIFOs and on-chip data storage to reduce external memory dependencies.
• I/O Density — 560 user I/O pins support wide parallel interfaces and dense peripheral connectivity for system-level integration.
• Power Supply — Core voltage range of 0.95 V to 1.05 V to match precise power delivery requirements for the device core.
• Package & Mounting — 1153-ball FCBGA (35 × 35 mm) package in a surface-mount form factor for board-level integration in space-constrained designs.
• Temperature & Grade — Industrial grade with an operating range of −40 °C to 100 °C for deployment in industrial and factory environments.

Typical Applications

• Industrial Control & Automation — Implements custom control logic, I/O aggregation and real-time processing while meeting industrial temperature requirements.
• Communications Infrastructure — Provides high I/O density and on-chip memory to support protocol handling, interface bridging and data buffering.
• Test & Measurement Equipment — Offers programmable logic capacity and local RAM for signal processing, pattern generation and acquisition tasks.

Unique Advantages

• High programmable density: 46,080 logic elements enable complex designs on a single FPGA, reducing the need for multiple discrete devices.
• Significant on-chip memory: Approximately 1.77 Mbits of embedded RAM reduces reliance on external memory for buffering and low-latency data paths.
• Extensive I/O connectivity: 560 I/O pins allow direct interfacing to sensors, buses and peripherals, simplifying board-level design.
• Industrial robustness: Specified for −40 °C to 100 °C operation, supporting reliable use in harsh or temperature-variable environments.
• Compact, surface-mount package: 1153-FCBGA (35 × 35 mm) enables high-density board layouts while providing the I/O fanout required by complex systems.

Why Choose XC5VLX50-2FFG1153I?

The XC5VLX50-2FFG1153I delivers a balance of high logic capacity, embedded memory and broad I/O connectivity in an industrial-grade FCBGA package. These attributes make it well suited for engineers developing dense, reprogrammable digital systems that must operate reliably across a wide temperature range.

This device is appropriate for teams seeking a single-FPGA solution to consolidate functions, reduce external components and support scalable designs where logic density and I/O count are primary considerations.

Request a quote or submit an inquiry for pricing and availability to evaluate the XC5VLX50-2FFG1153I for your next design.