XC5VLX50-1FFV676C

The XC5VLX50-1FFV676C is a Virtex-5 LX Field Programmable Gate Array from AMD, provided in a 676-ball FCBGA package. This device integrates a balance of programmable logic, embedded memory, and a high I/O count to support complex digital designs.

With 46,080 logic elements, approximately 1.77 Mbits of on-chip RAM, and 440 user I/O pins, the device is targeted at applications that require substantial logic capacity, embedded memory resources, and dense external connectivity while operating within a commercial temperature range.

Key Features

• Logic Capacity — 46,080 logic elements to implement large-scale programmable logic designs and custom digital functions.
• Embedded Memory — Approximately 1.77 Mbits of on-chip RAM for buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Resources — 440 user I/O pins to support extensive external interfacing and parallel connections.
• Core Voltage — Operates with a supply voltage range of 0.95 V to 1.05 V to match required core-level power rails.
• Package and Mounting — 676-BBGA / 676-FCBGA (27 × 27 mm) ball grid array, surface-mount package for compact board-level integration.
• Operating Temperature — Rated for commercial use from 0 °C to 85 °C.
• Compliance — RoHS-compliant construction for regulatory conformance in lead-free assemblies.

Typical Applications

• Programmable logic prototyping — Implement and iterate complex digital designs using the device's 46,080 logic elements and embedded memory.
• I/O-intensive interfaces — Support designs that require many external connections with the device's 440 user I/Os.
• On-chip memory buffering — Use approximately 1.77 Mbits of embedded RAM for data buffering, FIFOs, and localized storage within custom logic.

Unique Advantages

• Substantial logic density: 46,080 logic elements provide significant capacity for integrating multiple functions and custom accelerators on a single device.
• Integrated memory resources: Approximately 1.77 Mbits of on-chip RAM reduce the need for external memory in many designs, simplifying the bill of materials.
• High I/O count: 440 user I/Os enable broad external connectivity for sensors, peripherals, and parallel interfaces.
• Compact FCBGA package: The 676-ball FCBGA (27 × 27 mm) delivers a compact footprint for dense board layouts while supporting surface-mount assembly.
• Commercial temperature rating: Rated from 0 °C to 85 °C for applications operating in standard commercial environments.
• RoHS compliant: Meets RoHS requirements for lead-free manufacturing processes.

Why Choose XC5VLX50-1FFV676C?

The XC5VLX50-1FFV676C combines ample programmable logic, embedded RAM, and a high I/O count in a compact FCBGA package, making it well suited for designers who need integrated resources and dense interfacing on commercial-temperature designs. Its specification set supports consolidation of multiple digital functions onto a single FPGA, reducing external component count and board complexity.

Engineers and procurement teams seeking a Virtex-5 LX FPGA with verified logic density, on-chip memory, and extensive I/O will find this part a practical option for projects that require scalable programmable logic and a compact package footprint.

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