XC5VLX50-1FFG324I

IC FPGA 220 I/O 324FCBGA
Part Description

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 220 1769472 46080 324-BBGA, FCBGA

Quantity 712 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package324-FCBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-BBGA, FCBGANumber of I/O220Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs3600Number of Logic Elements/Cells46080
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1769472

Overview of XC5VLX50-1FFG324I – Virtex®-5 LX FPGA, 324-FCBGA, Industrial

The XC5VLX50-1FFG324I is a Virtex®-5 LX field programmable gate array (FPGA) in a 324-ball FCBGA package designed for industrial-grade applications. It provides a balanced combination of programmable logic resources, on-chip memory, and I/O density for systems requiring configurable digital logic and embedded memory.

Key attributes include 3,600 CLBs, 46,080 logic elements, approximately 1.77 Mbits of embedded RAM, 220 user I/O signals, a core supply range of 0.95–1.05 V, and an operating temperature range of −40 °C to 100 °C.

Key Features

  • Core Logic  3,600 CLBs providing a total of 46,080 logic elements for implementing custom digital logic and control functions.
  • Embedded Memory  Approximately 1.77 Mbits of on-chip RAM for buffering, state storage, and temporary data handling within designs.
  • I/O Capacity  220 user I/O pins to support a broad range of external interfaces and parallel connections.
  • Power Supply  Core voltage range of 0.95 V to 1.05 V to match system-level power design and supply sequencing requirements.
  • Package & Mounting  324-ball FCBGA (324-FCBGA, 19×19) surface-mount package for compact board-level integration.
  • Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C suitable for harsh-environment deployments.
  • Compliance  RoHS-compliant construction for adherence to common environmental directives.

Unique Advantages

  • High logic density: 46,080 logic elements enable complex digital functions and parallel processing within a single device, reducing external component count.
  • Significant on-chip memory: Approximately 1.77 Mbits of embedded RAM supports local buffering and state retention without immediate external memory.
  • Generous I/O count: 220 I/O pins provide flexibility for interfacing with sensors, controllers, and peripheral devices.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployment in temperature-challenging environments.
  • Compact surface-mount package: 324-FCBGA (19×19) enables dense PCB layouts and reliable ball-grid mounting for automated assembly.
  • Defined core voltage window: 0.95–1.05 V supply specification aids in system power planning and compatibility with voltage regulators.

Why Choose XC5VLX50-1FFG324I?

The XC5VLX50-1FFG324I offers a well-rounded FPGA solution for industrial designs that require substantial programmable logic, embedded memory, and a high I/O count in a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-life, environmentally demanding applications.

This device is appropriate for engineering teams seeking a scalable, integrated component to consolidate logic functions, reduce BOM complexity, and support ruggedized deployments while maintaining clearly defined electrical and thermal parameters.

Request a quote or submit an inquiry to check availability, lead times, and pricing for the XC5VLX50-1FFG324I.

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