XC5VLX50-1FFG324I
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 220 1769472 46080 324-BBGA, FCBGA |
|---|---|
| Quantity | 712 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FCBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-BBGA, FCBGA | Number of I/O | 220 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 3600 | Number of Logic Elements/Cells | 46080 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1769472 |
Overview of XC5VLX50-1FFG324I – Virtex®-5 LX FPGA, 324-FCBGA, Industrial
The XC5VLX50-1FFG324I is a Virtex®-5 LX field programmable gate array (FPGA) in a 324-ball FCBGA package designed for industrial-grade applications. It provides a balanced combination of programmable logic resources, on-chip memory, and I/O density for systems requiring configurable digital logic and embedded memory.
Key attributes include 3,600 CLBs, 46,080 logic elements, approximately 1.77 Mbits of embedded RAM, 220 user I/O signals, a core supply range of 0.95–1.05 V, and an operating temperature range of −40 °C to 100 °C.
Key Features
- Core Logic 3,600 CLBs providing a total of 46,080 logic elements for implementing custom digital logic and control functions.
- Embedded Memory Approximately 1.77 Mbits of on-chip RAM for buffering, state storage, and temporary data handling within designs.
- I/O Capacity 220 user I/O pins to support a broad range of external interfaces and parallel connections.
- Power Supply Core voltage range of 0.95 V to 1.05 V to match system-level power design and supply sequencing requirements.
- Package & Mounting 324-ball FCBGA (324-FCBGA, 19×19) surface-mount package for compact board-level integration.
- Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C suitable for harsh-environment deployments.
- Compliance RoHS-compliant construction for adherence to common environmental directives.
Unique Advantages
- High logic density: 46,080 logic elements enable complex digital functions and parallel processing within a single device, reducing external component count.
- Significant on-chip memory: Approximately 1.77 Mbits of embedded RAM supports local buffering and state retention without immediate external memory.
- Generous I/O count: 220 I/O pins provide flexibility for interfacing with sensors, controllers, and peripheral devices.
- Industrial temperature rating: −40 °C to 100 °C operation supports deployment in temperature-challenging environments.
- Compact surface-mount package: 324-FCBGA (19×19) enables dense PCB layouts and reliable ball-grid mounting for automated assembly.
- Defined core voltage window: 0.95–1.05 V supply specification aids in system power planning and compatibility with voltage regulators.
Why Choose XC5VLX50-1FFG324I?
The XC5VLX50-1FFG324I offers a well-rounded FPGA solution for industrial designs that require substantial programmable logic, embedded memory, and a high I/O count in a compact FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-life, environmentally demanding applications.
This device is appropriate for engineering teams seeking a scalable, integrated component to consolidate logic functions, reduce BOM complexity, and support ruggedized deployments while maintaining clearly defined electrical and thermal parameters.
Request a quote or submit an inquiry to check availability, lead times, and pricing for the XC5VLX50-1FFG324I.

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