XC5VLX50-1FFG1153CES
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 560 1769472 46080 1153-BBGA, FCBGA |
|---|---|
| Quantity | 1,618 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1153-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1153-BBGA, FCBGA | Number of I/O | 560 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 3600 | Number of Logic Elements/Cells | 46080 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1769472 |
Overview of XC5VLX50-1FFG1153CES – Virtex®-5 LX FPGA, 1153-FCBGA
The XC5VLX50-1FFG1153CES is a Virtex-5 LX field programmable gate array (FPGA) IC from AMD. It integrates 46,080 logic elements, approximately 1.77 Mbits of embedded memory, and up to 560 user I/O channels in a 1153-ball FCBGA package.
Built for commercial applications that require substantial logic density and on-chip memory, the device is supplied for surface-mount assembly and operates over a 0 °C to 85 °C temperature range with a core voltage supply of 0.95 V to 1.05 V.
Key Features
- Core Logic 46,080 logic elements distributed across 3,600 configurable logic blocks (CLBs) to support complex digital designs.
- Embedded Memory Approximately 1.77 Mbits of on-chip RAM to support data buffering, state machines, and local storage.
- I/O Capacity Up to 560 user I/O pins, enabling connectivity to a wide range of external devices and subsystems.
- Package & Mounting 1153-BBGA / 1153-FCBGA (35 × 35 mm) package in a surface-mount format for compact board-level integration.
- Power Core voltage supply range of 0.95 V to 1.05 V to match system power domains and regulator designs.
- Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant, meeting common lead-free manufacturing requirements.
Typical Applications
- High-density digital processing — Implement compute-intensive logic and custom processing pipelines using the device's large logic element count and CLB resources.
- Memory-backed control and buffering — Use on-chip RAM for data buffering, FIFO implementations, and state storage where local memory reduces external memory needs.
- High-pin-count interfacing — Leverage up to 560 I/O pins for multi-channel signal routing, peripheral interfacing, and system glue logic.
- Board-level integration in commercial products — Surface-mount FCBGA packaging and RoHS compliance support compact, manufacturable designs for commercial electronics.
Unique Advantages
- High logic capacity: 46,080 logic elements provide significant programmable resources for complex designs without immediate board-level changes.
- Substantial on-chip memory: Approximately 1.77 Mbits of embedded RAM reduces reliance on external memory for many applications, simplifying BOM and layouts.
- Extensive I/O: 560 user I/O pins enable broad connectivity options for multi-channel or mixed-signal systems.
- Compact package: 1153-FCBGA (35 × 35 mm) supports dense board integration while maintaining high signal count.
- Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with mainstream electronic product requirements.
- RoHS compliant: Supports lead-free manufacturing and regulatory compliance for many global markets.
Why Choose XC5VLX50-1FFG1153CES?
The XC5VLX50-1FFG1153CES positions itself as a commercial-grade Virtex-5 LX FPGA that balances high logic density, significant embedded memory, and a large I/O footprint in a single package. Its combination of 46,080 logic elements, approximately 1.77 Mbits of on-chip RAM, and 560 I/O make it suitable for designers who need compact, programmable hardware resources for complex digital systems.
This device is a fit for development teams and product engineers building commercial electronic systems that require on-chip memory, extensive I/O, and a compact surface-mount package, while meeting RoHS manufacturing requirements and operating within a 0 °C to 85 °C range.
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Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








