XC5VLX50-1FF676I

IC FPGA 440 I/O 676FCBGA
Part Description

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 440 1769472 46080 676-BBGA, FCBGA

Quantity 1,213 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BBGA, FCBGANumber of I/O440Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs3600Number of Logic Elements/Cells46080
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1769472

Overview of XC5VLX50-1FF676I – Virtex®-5 LX Field Programmable Gate Array (FPGA) IC, 676-FCBGA

The XC5VLX50-1FF676I is a Virtex®-5 LX field programmable gate array from AMD, offered in a 676-ball FCBGA package. It provides substantial logic capacity, on-chip memory, and a high I/O count for complex digital designs across industrial applications.

Key attributes include approximately 46,080 logic elements, roughly 1.77 Mbits of embedded memory, 440 I/O pins, industrial-grade temperature range, and a 950 mV–1.05 V core supply — making it suitable for designs that require dense logic resources and robust operating conditions.

Key Features

  • Logic Capacity  Approximately 46,080 logic elements and 3,600 logic blocks provide the programmable fabric required for complex custom logic and state machines.
  • Embedded Memory  Approximately 1.77 Mbits of on-chip RAM to support buffering, caching, and local data storage without external memory for many use cases.
  • I/O Density  440 user I/O pins enable broad connectivity to peripherals, high-speed interfaces, and multi-channel systems.
  • Power Supply  Core voltage specified at 0.95 V to 1.05 V, enabling predictable power domain planning for system designers.
  • Package  676-ball BGA (676-FCBGA, 27 × 27 mm) surface-mount package for board-level integration in space-constrained designs.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet a wide range of environmental requirements.
  • RoHS Compliant  Manufactured to comply with RoHS environmental requirements.

Typical Applications

  • Industrial Control  Custom motor control, PLC I/O expansion, and real-time control logic leveraging the device’s logic density and industrial temperature rating.
  • Signal Processing  DSP front-ends and data-path acceleration that use the on-chip RAM and programmable logic to implement custom processing pipelines.
  • Communications & Networking  Protocol bridging, packet processing, and interface adaptation using the high I/O count for multiple channels and peripherals.
  • Prototyping & System Integration  Platform and subsystem prototyping where a large programmable fabric and abundant I/Os simplify integration and iteration.

Unique Advantages

  • Substantial On-Chip Resources: The combination of ≈46,080 logic elements and ~1.77 Mbits of embedded RAM reduces reliance on external logic and memory, simplifying BOM and board layout.
  • High Connectivity: With 440 I/O pins, designers can support multiple interfaces and high-channel-count designs without extensive external bridging.
  • Industrial Robustness: Operation from −40 °C to 100 °C enables deployment in demanding environments where temperature resilience is required.
  • Simplified Power Planning: A defined core voltage range (0.95–1.05 V) assists system power design and regulator selection.
  • Compact Board Integration: The 676-FCBGA (27 × 27 mm) footprint delivers high density in a surface-mount package suitable for advanced PCB layouts.
  • Regulatory Compliance: RoHS compliance supports environmental requirements for many industrial and commercial programs.

Why Choose XC5VLX50-1FF676I?

The XC5VLX50-1FF676I balances significant programmable logic resources, embedded memory, and a high I/O count within an industrial-grade package and temperature range. It is positioned for engineers and procurement teams seeking a Virtex®-5 LX FPGA that supports dense logic implementations and robust environmental performance.

This device is well suited to system designs that require on-chip memory, broad peripheral connectivity, and a compact BGA footprint — providing scalable capacity for mid-to-high complexity custom logic and integration tasks.

Request a quote or submit an inquiry to begin procurement or to obtain pricing and availability information for the XC5VLX50-1FF676I.

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