XC5VLX50-1FFG1153I

The XC5VLX50-1FFG1153I is a Virtex®-5 LX field programmable gate array (FPGA) device by AMD, provided in a 1153-ball FCBGA package. It delivers a combination of programmable logic resources, embedded memory, and a high I/O count for designs that require substantial on-chip capacity and broad external connectivity.

With 46,080 logic elements, approximately 1.77 Mbits of embedded memory, and up to 560 I/O pins, this industrial-grade FPGA is targeted at applications that need large-scale programmable logic, high-density interfacing, and operation across a wide temperature range.

Key Features

• Programmable Logic Capacity 46,080 logic elements provide extensive on-chip programmable logic for implementing complex custom functions and parallel processing architectures.
• Embedded Memory Approximately 1.77 Mbits of on-chip RAM to store buffers, state machines, and local data for low-latency access.
• High I/O Count Up to 560 I/O pins to support numerous external interfaces, sensors, and peripheral devices without extensive external multiplexing.
• Power Supply Range Core voltage support from 950 mV to 1.05 V to match system power-rail requirements for the device core.
• Package and Mounting 1153-ball FCBGA (35 × 35 mm) package in a surface-mount format to enable compact board layouts while retaining high pin density.
• Industrial Temperature Grade Specified operating range from −40 °C to 100 °C to meet industrial-environment requirements.
• Standards Compliance RoHS-compliant construction for regulatory and manufacturability considerations.

Typical Applications

• Industrial Control — Use in programmable logic and control systems that require industrial temperature operation and robust on-board logic and memory.
• High-density I/O Systems — Suitable for designs needing many external connections, such as multi-channel data acquisition or large peripheral arrays, leveraging up to 560 I/O pins.
• Embedded Logic and Custom Processing — Implement custom accelerators, protocol handling, or state machines using the device’s 46,080 logic elements and embedded RAM.

Unique Advantages

• High Logic Capacity: 46,080 logic elements enable complex designs and parallel processing implementations without immediate need for external ASICs.
• Meaningful On-chip Memory: Approximately 1.77 Mbits of embedded RAM reduces external memory dependencies for many control and buffering tasks.
• Extensive I/O Availability: Up to 560 I/Os simplify interfacing to multiple peripherals and high-channel-count systems.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in harsh or temperature-variable environments.
• Compact, High-density Package: 1153-ball FCBGA (35 × 35 mm) supports dense PCB layouts while providing broad connectivity.
• Regulatory Compliance: RoHS-compliant construction supports regulatory requirements for manufacturing and supply chains.

Why Choose XC5VLX50-1FFG1153I?

The XC5VLX50-1FFG1153I balances significant programmable logic resources, embedded memory, and a very high I/O count in an industrial-grade FCBGA package. Its electrical and thermal specifications make it suitable for engineers building robust, high-capacity FPGA-based systems that require reliable operation across a wide temperature range.

This device is well suited to development teams and production engineers seeking a scalable, high-density FPGA solution for custom processing, control systems, and multi-interface designs, while maintaining compliance with RoHS requirements.

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