XC5VLX50-1FF676C

IC FPGA 440 I/O 676FCBGA
Part Description

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 440 1769472 46080 676-BBGA, FCBGA

Quantity 1,107 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BBGA, FCBGANumber of I/O440Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs3600Number of Logic Elements/Cells46080
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1769472

Overview of XC5VLX50-1FF676C – Virtex®-5 LX FPGA, 676‑FCBGA

The XC5VLX50-1FF676C is a Virtex®-5 LX Field Programmable Gate Array (FPGA) IC offering substantial programmable logic, on-chip memory, and a high I/O count in a compact 676‑FCBGA package. It provides a configurable hardware platform for designers who require significant logic resources and embedded memory within a surface-mount, commercial-grade device.

Key device attributes include 46,080 logic elements, approximately 1.77 Mbits of on-chip RAM, 440 I/O, a 950 mV to 1.05 V supply range, and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Logic Resources 46,080 logic elements for implementing complex, high-density logic functions.
  • Embedded Memory Approximately 1.77 Mbits of on-chip RAM (1,769,472 bits) to support data buffering, state storage, and local memory needs.
  • I/O Capacity 440 available I/O pins to interface with external peripherals, memory, and system buses.
  • Power and Core Voltage Core supply range from 950 mV to 1.05 V to match target system power architectures.
  • Package Supplier device package: 676‑FCBGA (27 × 27), providing a high-pin-count flip-chip BGA form factor suitable for dense board designs.
  • Mounting and Grade Surface-mount device, commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Regulatory RoHS compliant.

Unique Advantages

  • High logic density: 46,080 logic elements enable implementation of large, complex digital designs without immediate need for external logic.
  • Significant on-chip memory: Approximately 1.77 Mbits of embedded RAM reduces dependence on external memory for mid-sized data storage and buffering.
  • Generous I/O availability: 440 I/O pins support extensive interfacing options for multi-peripheral systems.
  • Compact, high-pin-count package: The 676‑FCBGA (27 × 27) package consolidates many signals in a space-efficient footprint for dense PCB layouts.
  • Commercial temperature suitability: Rated 0 °C to 85 °C for a wide range of standard commercial applications.
  • RoHS compliant: Meets common environmental compliance requirements for assembly.

Why Choose XC5VLX50-1FF676C?

The XC5VLX50-1FF676C positions itself as a high-capacity Virtex‑5 LX FPGA option that balances logic density, embedded memory, and extensive I/O in a single, surface-mount package. It is well suited for designers and procurement teams seeking a commercial-grade FPGA with measurable on-chip resources and a compact 676‑FCBGA footprint.

For projects that require a programmable, integrated logic platform with defined supply and temperature ranges, this part provides predictable electrical and mechanical characteristics to aid system integration and board-level planning.

Request a quote or submit a purchase inquiry to receive availability and pricing information for the XC5VLX50-1FF676C.

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