XC5VLX50-1FF324C
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 220 1769472 46080 324-BBGA, FCBGA |
|---|---|
| Quantity | 1,573 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FCBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-BBGA, FCBGA | Number of I/O | 220 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 3600 | Number of Logic Elements/Cells | 46080 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1769472 |
Overview of XC5VLX50-1FF324C – Virtex®-5 LX FPGA, 324‑BBGA
The XC5VLX50-1FF324C is a Virtex®-5 LX field-programmable gate array (FPGA) offered in a 324‑ball FCBGA (324‑BBGA) package. It provides a balance of programmable logic, on-chip memory and I/O density for commercial embedded and system-level designs that require flexible hardware implementation within a surface-mount package.
Designed for commercial temperature operation, this device combines 46,080 logic elements, approximately 1.77 Mbits of embedded RAM, and up to 220 user I/O to support a range of programmable-logic applications while operating from a 0.95 V to 1.05 V core supply.
Key Features
- Core Logic 46,080 logic elements provide substantial programmable logic capacity for implementing custom digital functions and control logic.
- Embedded Memory Approximately 1.77 Mbits of on-chip RAM suitable for buffering, state storage and small data tables within the FPGA fabric.
- I/O Density Up to 220 user I/O pins support a variety of external interfaces and high-density connectivity in compact board designs.
- Package & Mounting Available in a 324‑BBGA (324‑FCBGA, 19×19) package optimized for surface-mount assembly on modern PCBs.
- Power Core voltage operation from 0.95 V to 1.05 V enables defined power delivery design and compatibility with targeted power rails.
- Temperature & Grade Commercial grade device rated for 0 °C to 85 °C ambient operation and RoHS compliant for regulatory alignment.
Typical Applications
- Embedded Systems Implement custom processing, protocol handling and glue logic within compact commercial products using on-chip logic and memory.
- Communications Equipment Support interface bridging, packet processing and peripheral aggregation where programmable logic and plentiful I/O are required.
- Prototyping & Evaluation Use the device for hardware validation and design prototyping that benefits from reprogrammable logic and moderate memory resources.
- Control & Automation Implement control algorithms, state machines and I/O management in commercial automation and instrumentation equipment.
Unique Advantages
- Substantial Logic Capacity: 46,080 logic elements enable implementation of complex custom logic and multi-function designs without external CPLDs.
- On‑Chip Memory Accessibility: Approximately 1.77 Mbits of embedded RAM reduces external memory requirements for buffering and temporary storage.
- High I/O Count: 220 user I/Os allow integration of multiple peripherals and interfaces directly to the FPGA fabric, simplifying board routing.
- Compact Surface‑Mount Package: 324‑BBGA (19×19 FCBGA) packaging supports high-density board layouts while remaining compatible with standard SMT assembly.
- Commercial Temperature Range: Rated 0 °C to 85 °C to meet typical commercial product operating environments.
- RoHS Compliant: Conforms to RoHS requirements to meet common regulatory and manufacturing standards.
Why Choose XC5VLX50-1FF324C?
The XC5VLX50-1FF324C positions itself as a commercial-grade Virtex®-5 LX FPGA option for designs that require a balanced mix of logic, on-chip memory and I/O connectivity in a surface-mount FCBGA footprint. Its defined core voltage range and RoHS compliance make it suitable for mainstream commercial products that need reprogrammable hardware capability.
This device is well suited to engineers and teams building embedded systems, communication interfaces, prototyping platforms and control solutions that benefit from moderate to high logic capacity, integrated memory, and a dense I/O complement—delivered in a compact 324‑ball package.
Request a quote or submit an inquiry to receive pricing and availability for the XC5VLX50-1FF324C and to discuss how it fits your next commercial FPGA design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








