XC5VLX330T-2FFG1738C

The XC5VLX330T-2FFG1738C is a Virtex®-5 LXT Field Programmable Gate Array (FPGA) manufactured by AMD, delivered in a 1738-BBGA FCBGA package. It combines high logic capacity and substantial on-chip memory with a large I/O count for complex, high-density digital designs.

This commercial-grade, surface-mount device provides approximately 331,776 logic elements and roughly 11.94 Mbits of embedded memory, making it suitable for designs that require significant logic resources, memory integration, and extensive external interfacing within a 42.5 × 42.5 mm package footprint.

Key Features

• Core Logic Approximately 331,776 logic elements to support large, parallelizable designs and complex logic implementations.
• Embedded Memory Approximately 11.94 Mbits of on-chip RAM to support buffering, state storage, and local data processing without external memory for many functions.
• I/O Density 960 user I/O pins for extensive external connectivity, enabling rich sensor, actuator, and peripheral interfacing.
• Power Core supply range of 0.950 V to 1.05 V to align with system power-rail planning and efficient core operation.
• Package 1738-BBGA (1738-FCBGA) surface-mount package with a 42.5 × 42.5 mm footprint for compact, high-density board layouts.
• Operating Range Commercial operating temperature from 0 °C to 85 °C suitable for standard commercial applications.
• Compliance RoHS-compliant manufacturing to meet common environmental and regulatory requirements.

Typical Applications

• High-density signal processing Leverage the large logic fabric and embedded memory for compute-intensive processing pipelines and custom DSP implementations.
• Data aggregation and buffering Use the substantial on-chip RAM and high I/O count to aggregate, stage, and forward data between multiple interfaces.
• Prototyping and system integration Provide a platform for integrating large custom logic blocks and multiple peripherals in a single FPGA for validation and system integration tasks.

Unique Advantages

• High logic capacity: Approximately 331,776 logic elements enable complex, large-scale designs without immediate partitioning across multiple devices.
• Significant on-chip memory: Approximately 11.94 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
• Extensive connectivity: 960 I/O pins provide flexibility for multi-lane interfaces, parallel buses, and numerous peripheral connections.
• Compact, high-density package: 1738-FCBGA (42.5 × 42.5 mm) offers a balanced footprint for board-level integration where area and I/O density are important.
• Commercial temperature rating: Operates across 0 °C to 85 °C for standard commercial deployments and product lines.
• RoHS compliant: Manufactured to meet environmental compliance requirements.

Why Choose XC5VLX330T-2FFG1738C?

The XC5VLX330T-2FFG1738C positions itself as a high-capacity FPGA option for engineers who require substantial logic resources, on-chip memory, and broad I/O in a single commercial-grade device. Its combination of approximately 331,776 logic elements, roughly 11.94 Mbits of embedded memory, and 960 I/O pins supports complex system integration and data-heavy designs within a compact FCBGA footprint.

This device is suited for teams developing large-scale digital designs, data aggregation solutions, or integration platforms that benefit from consolidated logic and memory resources, a dense I/O complement, and standard commercial operating conditions. Its RoHS compliance and surface-mount package further simplify inclusion in modern production workflows.

Request a quote or submit an inquiry to discuss pricing, availability, and how the XC5VLX330T-2FFG1738C can fit your next design. Our team can provide additional procurement and configuration support to move your project forward.