XC5VLX330T-1FF1738I
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 960 11943936 331776 1738-BBGA, FCBGA |
|---|---|
| Quantity | 1,699 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1738-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1738-BBGA, FCBGA | Number of I/O | 960 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 25920 | Number of Logic Elements/Cells | 331776 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 11943936 |
Overview of XC5VLX330T-1FF1738I – Virtex®-5 LXT Field Programmable Gate Array, 331,776 logic elements, 960 I/Os
The XC5VLX330T-1FF1738I is a Virtex®-5 LXT Field Programmable Gate Array from AMD, delivering a large programmable fabric for complex digital designs. With 331,776 logic elements, approximately 11.94 Mbits of embedded memory and 960 general-purpose I/Os, it targets systems that require high logic capacity, substantial on-chip RAM and dense I/O connectivity.
Packaged in a 1738-ball FCBGA (42.5 × 42.5 mm) and specified for industrial operation, this device is suited to applications where integration density, memory resources and I/O count are primary design drivers.
Key Features
- Core Logic 331,776 logic elements provide extensive programmable resources for implementing complex custom logic and parallel processing architectures.
- Embedded Memory Approximately 11.94 Mbits of on-chip RAM to support large buffering, lookup tables and state storage without external memory.
- I/O Density 960 I/O pins enable dense external connectivity for interfacing to high-channel-count systems and multiple peripherals.
- Power Core voltage supply range of 0.95 V to 1.05 V to match platform power domains and support standard FPGA core voltages.
- Package 1738-ball FCBGA package (42.5 × 42.5 mm) for high-pin-count, high-density board-level integration using surface-mount assembly.
- Temperature & Grade Industrial grade with an operating temperature range of −40°C to 100°C for deployment in temperature-challenging environments.
- Compliance RoHS compliant, meeting common lead-free environmental requirements.
Typical Applications
- Telecommunications Equipment Use the device to implement protocol engines, packet processing and interface bridging where high I/O count and large logic resources are required.
- Data Acquisition & Processing High on-chip RAM and abundant logic elements support real-time data buffering, preprocessing and algorithm acceleration for measurement systems.
- Industrial Control Industrial-grade temperature range and dense I/O make it suitable for complex control logic, motor control and plant automation systems.
- High-density Prototyping and Custom Logic Large programmable fabric and memory allow engineers to prototype and deploy highly integrated custom digital functions on a single device.
Unique Advantages
- Extensive Programmable Capacity: 331,776 logic elements enable implementation of large-scale, partitioned designs without immediate reliance on external logic.
- Significant On-chip Memory: Approximately 11.94 Mbits of embedded RAM reduces external memory needs for buffering and lookup operations, simplifying system BOM.
- High I/O Count: 960 I/Os provide flexibility for multi-channel interfaces and parallel connectivity, minimizing the need for external IO expanders.
- Industrial Temperature Support: Rated from −40°C to 100°C to accommodate demanding operating environments and help maintain system reliability.
- Compact, High-density Package: The 1738-ball FCBGA (42.5 × 42.5 mm) delivers a high pin count in a manageable PCB footprint for space-constrained designs.
- RoHS Compliant: Meets common environmental requirements for lead-free manufacturing and fielded equipment.
Why Choose XC5VLX330T-1FF1738I?
The XC5VLX330T-1FF1738I combines a large programmable fabric, substantial embedded memory and a very high I/O count in an industrial-grade FCBGA package, making it a strong choice for engineers building high-integration digital systems. Its specification set aligns with designs that need extensive on-chip resources and reliable operation across a wide temperature range.
Manufactured by AMD, this Virtex®-5 LXT device is positioned for applications where logic density, memory capacity and I/O throughput drive architectural decisions. It suits development teams and integrators seeking a scalable, high-capacity FPGA for complex signal processing, control and interfacing tasks.
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