XC5VLX330T-1FF1738I

IC FPGA 960 I/O 1738FCBGA
Part Description

Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 960 11943936 331776 1738-BBGA, FCBGA

Quantity 1,699 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1738-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1738-BBGA, FCBGANumber of I/O960Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs25920Number of Logic Elements/Cells331776
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits11943936

Overview of XC5VLX330T-1FF1738I – Virtex®-5 LXT Field Programmable Gate Array, 331,776 logic elements, 960 I/Os

The XC5VLX330T-1FF1738I is a Virtex®-5 LXT Field Programmable Gate Array from AMD, delivering a large programmable fabric for complex digital designs. With 331,776 logic elements, approximately 11.94 Mbits of embedded memory and 960 general-purpose I/Os, it targets systems that require high logic capacity, substantial on-chip RAM and dense I/O connectivity.

Packaged in a 1738-ball FCBGA (42.5 × 42.5 mm) and specified for industrial operation, this device is suited to applications where integration density, memory resources and I/O count are primary design drivers.

Key Features

  • Core Logic  331,776 logic elements provide extensive programmable resources for implementing complex custom logic and parallel processing architectures.
  • Embedded Memory  Approximately 11.94 Mbits of on-chip RAM to support large buffering, lookup tables and state storage without external memory.
  • I/O Density  960 I/O pins enable dense external connectivity for interfacing to high-channel-count systems and multiple peripherals.
  • Power  Core voltage supply range of 0.95 V to 1.05 V to match platform power domains and support standard FPGA core voltages.
  • Package  1738-ball FCBGA package (42.5 × 42.5 mm) for high-pin-count, high-density board-level integration using surface-mount assembly.
  • Temperature & Grade  Industrial grade with an operating temperature range of −40°C to 100°C for deployment in temperature-challenging environments.
  • Compliance  RoHS compliant, meeting common lead-free environmental requirements.

Typical Applications

  • Telecommunications Equipment  Use the device to implement protocol engines, packet processing and interface bridging where high I/O count and large logic resources are required.
  • Data Acquisition & Processing  High on-chip RAM and abundant logic elements support real-time data buffering, preprocessing and algorithm acceleration for measurement systems.
  • Industrial Control  Industrial-grade temperature range and dense I/O make it suitable for complex control logic, motor control and plant automation systems.
  • High-density Prototyping and Custom Logic  Large programmable fabric and memory allow engineers to prototype and deploy highly integrated custom digital functions on a single device.

Unique Advantages

  • Extensive Programmable Capacity: 331,776 logic elements enable implementation of large-scale, partitioned designs without immediate reliance on external logic.
  • Significant On-chip Memory: Approximately 11.94 Mbits of embedded RAM reduces external memory needs for buffering and lookup operations, simplifying system BOM.
  • High I/O Count: 960 I/Os provide flexibility for multi-channel interfaces and parallel connectivity, minimizing the need for external IO expanders.
  • Industrial Temperature Support: Rated from −40°C to 100°C to accommodate demanding operating environments and help maintain system reliability.
  • Compact, High-density Package: The 1738-ball FCBGA (42.5 × 42.5 mm) delivers a high pin count in a manageable PCB footprint for space-constrained designs.
  • RoHS Compliant: Meets common environmental requirements for lead-free manufacturing and fielded equipment.

Why Choose XC5VLX330T-1FF1738I?

The XC5VLX330T-1FF1738I combines a large programmable fabric, substantial embedded memory and a very high I/O count in an industrial-grade FCBGA package, making it a strong choice for engineers building high-integration digital systems. Its specification set aligns with designs that need extensive on-chip resources and reliable operation across a wide temperature range.

Manufactured by AMD, this Virtex®-5 LXT device is positioned for applications where logic density, memory capacity and I/O throughput drive architectural decisions. It suits development teams and integrators seeking a scalable, high-capacity FPGA for complex signal processing, control and interfacing tasks.

Request a quote or submit an inquiry to receive pricing and availability information for the XC5VLX330T-1FF1738I.

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