XC5VLX330-1FFG1760I

The XC5VLX330-1FFG1760I is a Virtex®-5 LX field-programmable gate array (FPGA) IC from AMD, delivered in a 1760-FCBGA package. It provides a combination of large logic capacity, substantial on-chip memory, and a high I/O count for designs that require dense, reconfigurable logic and extensive interfacing.

With an industrial operating temperature range and a defined core voltage window, this device targets applications that need sustained operation across extended temperature environments while offering high integration density and flexibility.

Key Features

• Core logic — 331,776 logic elements to implement complex digital functions and wide parallel processing pipelines.
• Embedded memory — approximately 10.6 Mbits of on-chip RAM (10,616,832 bits) for buffering, FIFOs, and local storage.
• I/O capacity — 1,200 user I/Os to support high-channel-count interfaces and dense board-level connectivity.
• Package — 1760-FCBGA (1760-BBGA) package with a 42.5 × 42.5 mm footprint for compact, high-pin-count implementations.
• Power — Core voltage supply range of 0.95 V to 1.05 V to align with defined power-domain requirements.
• Temperature and grade — Industrial grade with an operating range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance — RoHS compliant.

Typical Applications

• High-density signal processing — Implement complex DSP and algorithmic pipelines using the device's large logic capacity and on-chip RAM for intermediate buffering.
• Complex control and automation — Support industrial controllers and automation equipment that require many I/Os and operation across extended temperature ranges.
• Multi-channel data acquisition — Aggregate and preprocess data from numerous sensors or interfaces using the high I/O count and embedded memory.
• System integration and prototyping — Consolidate multiple functions into a single FPGA for rapid integration and iterative design cycles.

Unique Advantages

• Large programmable capacity: 331,776 logic elements enable implementation of complex systems and high-parallelism designs on a single device.
• Substantial embedded memory: Approximately 10.6 Mbits of on-chip RAM reduces external memory dependency for buffering and real-time data handling.
• Extensive I/O: 1,200 I/Os provide the connectivity needed for dense, multi-channel systems and high-port-count interfaces.
• Industrial-ready packaging: The 1760-FCBGA package in a 42.5 × 42.5 mm footprint supports high-pin integration while meeting industrial temperature requirements.
• Defined core power domain: Tight supply range (0.95–1.05 V) facilitates predictable power-domain design and board-level power planning.
• Regulatory compliance: RoHS compliance helps meet environmental requirements for production deployment.

Why Choose XC5VLX330-1FFG1760I?

The XC5VLX330-1FFG1760I is positioned for designs that demand high logic density, significant on-chip memory, and a very large number of I/Os, all within an industrial temperature-rated package. Its specification set suits engineers consolidating complex functions into a single FPGA while maintaining robust operation across temperature extremes.

Manufactured by AMD and offered in a 1760-FCBGA package, this device delivers a balance of integration, capacity, and predictable power requirements for long-term deployment in industrial and high-density system applications.

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