XC5VLX330-1FFG1760C

The XC5VLX330-1FFG1760C is a Virtex®-5 LX Field Programmable Gate Array (FPGA) from AMD, delivered in a 1760-ball flip-chip BGA package (1760-FCBGA, 42.5 × 42.5 mm). This device provides a very large logic capacity and extensive I/O, making it suitable for designs that require high-density programmable logic and substantial on-chip memory.

With 331,776 logic elements, approximately 10.6 Mbits of embedded memory, and 1,200 I/O pins, the device targets applications demanding large gate counts, rich I/O connectivity, and board-level integration in a commercial temperature range.

Key Features

• Logic Capacity 331,776 logic elements for large-scale digital design integration and complex logic implementation.
• Embedded Memory Approximately 10.6 Mbits of on-chip RAM to support data buffering, FIFOs, and packet or signal processing functions.
• I/O 1,200 I/O pins to support dense external interfacing and high pin-count connectivity requirements.
• Power Core voltage supply specified from 950 mV to 1.05 V for core power planning and system supply design.
• Package & Mounting 1760-ball FCBGA package (1760-FCBGA, 42.5 × 42.5 mm), surface-mountable for compact board layouts.
• Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory RoHS compliant for regulatory and environmental conformity.

Typical Applications

• High-density digital systems — Implement complex ASIC-like logic and algorithm acceleration using the device's extensive logic element count.
• High-pin-count interfaces — Use 1,200 I/O pins for multi-channel data acquisition, board-level aggregation, and dense peripheral connectivity.
• Embedded memory-dependent designs — Leverage approximately 10.6 Mbits of on-chip RAM for buffering, packet handling, and intermediate data storage.
• Prototype and development platforms — Ideal for developers requiring a large programmable fabric in a surface-mount 1760-FCBGA package for system-level validation.

Unique Advantages

• Substantial logic capacity: 331,776 logic elements enable consolidation of multiple functions into a single FPGA, reducing external glue logic.
• Generous on-chip RAM: Approximately 10.6 Mbits of embedded memory supports high-throughput buffering and local data storage without external memory.
• Extensive I/O count: 1,200 I/Os simplify system partitioning and allow direct interfacing to numerous peripherals and high-channel-count designs.
• Compact FCBGA package: The 1760-FCBGA (42.5 × 42.5 mm) minimizes board footprint while providing high pin density for complex boards.
• Commercial-grade operating range: Designed for systems that operate within 0 °C to 85 °C, aligning with standard commercial deployments.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose XC5VLX330-1FFG1760C?

The XC5VLX330-1FFG1760C positions itself as a high-capacity Virtex®-5 LX FPGA solution for designers needing significant programmable logic, abundant embedded memory, and broad I/O connectivity in a single surface-mount package. Its combination of 331,776 logic elements, approximately 10.6 Mbits of on-chip RAM, and 1,200 I/Os supports consolidation of complex functions and simplifies board-level design.

As a commercial-grade AMD device in a 1760-FCBGA package, it fits projects focused on high-density programmable implementations where RoHS compliance and defined operating conditions (0 °C to 85 °C) are required. Choose this part when your design demands substantial logic resources, extensive I/O, and a compact package footprint.

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