XC5VLX30T-2FFG665I

The XC5VLX30T-2FFG665I is a Virtex®-5 LXT field programmable gate array (FPGA) offered in a 665‑ball FCBGA package. It delivers a combination of reprogrammable logic, on‑chip memory, and extensive I/O suited to industrial applications.

With 30,720 logic elements, approximately 1.33 Mbits of embedded RAM, and 360 I/O pins, this device targets designs that require significant programmable logic and connectivity while operating over a wide industrial temperature range and low core voltage.

Key Features

• Logic Resources  2,400 CLBs and 30,720 logic elements provide substantial programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 1.33 Mbits (1,327,104 bits) of on‑chip RAM supports buffering, state storage, and algorithm implementation without external memory.
• I/O Density  360 available I/O pins enable connectivity to a wide range of peripherals, sensors, and interfaces.
• Package & Mounting  665‑ball FCBGA (665‑BBGA), supplier device package 665‑FCBGA (27×27), supplied as a surface‑mount device for PCB integration.
• Power  Core supply voltage range of 0.95 V to 1.05 V for compatibility with low‑voltage power domains.
• Temperature & Grade  Industrial grade device specified for operation from ‑40 °C to 100 °C.
• Environmental Compliance  RoHS compliant for restricted substance requirements.

Typical Applications

• Industrial Control and Automation  Industrial grade operation (‑40 °C to 100 °C) and ample I/O make this FPGA suitable for programmable logic controllers, motion control, and factory automation systems.
• Embedded Signal Processing  Large logic resource count and on‑chip RAM enable implementation of custom signal processing, protocol handling, and data‑manipulation blocks.
• Communications and Networking  High I/O density and reconfigurable logic allow interface bridging, packet processing, and protocol acceleration in networking equipment.

Unique Advantages

• Significant Logic Capacity: 30,720 logic elements and 2,400 CLBs allow complex, multi‑function FPGA designs without immediate need for larger devices.
• Integrated On‑Chip Memory: Approximately 1.33 Mbits of embedded RAM reduces dependence on external memory for many buffering and state storage needs.
• High I/O Count: 360 I/O pins provide flexibility for interfacing to multiple peripherals and sensors, simplifying board-level design.
• Industrial Temperature Range: Rated from ‑40 °C to 100 °C to meet the thermal demands of industrial environments.
• Compact Surface‑Mount Package: 665‑ball FCBGA (27×27) package supports dense PCBs and modern board assembly processes.
• Low Core Voltage: 0.95 V to 1.05 V core supply supports low‑voltage system architectures.

Why Choose XC5VLX30T-2FFG665I?

The XC5VLX30T-2FFG665I positions itself as an industrial‑grade, reprogrammable logic device that balances substantial logic capacity, on‑chip memory, and high I/O density within a compact FCBGA package. It is well suited to engineering teams designing industrial control, embedded processing, or communications systems that require reconfigurable hardware operating across a wide temperature range.

By combining programmable logic, embedded RAM, and robust I/O in a RoHS‑compliant, surface‑mount FCBGA package, this device offers designers a scalable building block for complex system functions while supporting integration into industrial PCBs and assemblies.

Request a quote or submit your requirements for pricing and availability to move your design forward with the XC5VLX30T-2FFG665I.