XC5VLX30T-2FF323I
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 172 1327104 30720 323-BBGA, FCBGA |
|---|---|
| Quantity | 998 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 323-FCBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 323-BBGA, FCBGA | Number of I/O | 172 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2400 | Number of Logic Elements/Cells | 30720 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1327104 |
Overview of XC5VLX30T-2FF323I – Virtex®‑5 LXT FPGA, 323‑FCBGA, Industrial Grade
The XC5VLX30T-2FF323I is a Virtex‑5 LXT field programmable gate array (FPGA) offered in a 323‑ball FCBGA package. It combines a high count of logic resources, embedded memory, and a broad I/O complement in an industrial‑grade device designed for surface‑mount implementation.
With 30,720 logic elements, approximately 1.33 Mbits of on‑chip RAM, and 172 I/O, this device targets designs that require substantial programmable logic, moderate embedded memory, and a flexible I/O interface while operating across a wide industrial temperature range.
Key Features
- Core and Logic 2,400 configurable logic blocks (CLBs) delivering 30,720 logic elements for implementing complex custom logic and datapaths.
- Embedded Memory Approximately 1.33 Mbits of on‑chip RAM to support buffers, FIFOs, and on‑device data storage.
- I/O 172 user I/O pins to interface with external peripherals, memories, and high‑speed serializers/deserializers.
- Package and Mounting 323‑BBGA (FCBGA) package, supplier package 323‑FCBGA (19×19), designed for surface‑mount assembly.
- Power Core supply range of 950 mV to 1.05 V to match system power rails and regulator designs.
- Temperature and Grade Industrial grade device rated for operation from −40 °C to 100 °C.
- Compliance RoHS compliant construction for regulatory and environmental considerations.
Unique Advantages
- High logic density: 30,720 logic elements enable implementation of complex logic functions and parallel processing within a single device.
- Significant embedded memory: Approximately 1.33 Mbits of on‑chip RAM supports local buffering and state storage without external memory in many use cases.
- Generous I/O count: 172 I/O pins facilitate multiple external interfaces and parallel connections, reducing the need for additional I/O expanders.
- Industrial temperature range: Rated from −40 °C to 100 °C for deployment in industrial environments with wider thermal variation.
- Board‑level integration: 323‑ball FCBGA surface‑mount package provides a compact footprint suited to high‑density PCB layouts.
- Standards‑aware manufacturing: RoHS compliance supports environmental and manufacturing requirements.
Why Choose XC5VLX30T-2FF323I?
The XC5VLX30T-2FF323I positions itself as a robust Virtex‑5 LXT FPGA option for designs that require a balance of logic capacity, embedded memory, and I/O flexibility within an industrial temperature window. Its specified core voltage range and FCBGA packaging support common board power architectures and compact PCB designs.
This device is suitable for engineering teams developing industrial and embedded systems that need verified logic resources and memory on a single programmable device. Backed by the Virtex‑5 family documentation and manufacturer resources, it offers a practical platform for scalable hardware designs.
Request a quote or submit an inquiry to obtain pricing, availability, and additional procurement details for the XC5VLX30T-2FF323I.

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