XC5VLX30T-1FFG665CES
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 360 1327104 30720 665-BBGA, FCBGA |
|---|---|
| Quantity | 656 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 665-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 665-BBGA, FCBGA | Number of I/O | 360 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2400 | Number of Logic Elements/Cells | 30720 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1327104 |
Overview of XC5VLX30T-1FFG665CES – Virtex®-5 LXT Field Programmable Gate Array (FPGA)
The XC5VLX30T-1FFG665CES is a Virtex®-5 LXT field programmable gate array (FPGA) manufactured by AMD. It provides a combination of on-chip logic capacity, embedded memory, and high I/O count in a surface-mount FCBGA package for commercial-grade designs.
This device is suited to designs that require substantial programmable logic (30,720 logic elements), significant embedded memory (approximately 1.33 Mbits), and up to 360 user I/O lines, while operating within a 0.95–1.05 V core supply range and a commercial temperature window.
Key Features
- Core Capacity 2,400 logic blocks and 30,720 logic elements provide programmable resources for complex digital designs.
- Embedded Memory Approximately 1.33 Mbits of on-chip RAM to support buffering, state machines, and local data storage.
- I/O Up to 360 user I/O pins to support dense interfacing and multiple peripheral connections.
- Power Core voltage supply range of 0.95–1.05 V to meet system power requirements.
- Package & Mounting 665-ball FCBGA package (665-BBGA, supplier package: 665-FCBGA (27×27)), surface-mount mounting for compact board integration.
- Operating Conditions & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- High-density I/O systems Ideal for applications that require many parallel interfaces or signal lines, leveraging the 360 available I/O connections.
- Memory-aware processing Suitable for designs needing local buffering and fast on-chip storage thanks to approximately 1.33 Mbits of embedded RAM.
- Custom digital logic and prototyping Provides a substantial logic element count (30,720) for implementing custom accelerators, protocol engines, or complex control logic.
Unique Advantages
- Substantial programmable logic: 30,720 logic elements support complex, integrated digital functions without external ASIC development.
- Generous on-chip memory: Approximately 1.33 Mbits of RAM reduces dependence on external memory for many buffering and stateful tasks.
- High I/O density: 360 I/O pins enable broad interfacing options for sensors, peripherals, and multi-channel data paths.
- Compact, surface-mount FCBGA: 665-ball FCBGA (27×27) package balances high resource density with a compact board footprint.
- Defined commercial operating range: Operates across 0 °C to 85 °C and is RoHS compliant for standard commercial applications.
- Controlled core power window: 0.95–1.05 V supply range aligns with expected system power rails for the device.
Why Choose XC5VLX30T-1FFG665CES?
Designed by AMD, the XC5VLX30T-1FFG665CES delivers a balanced combination of logic capacity, embedded memory, and high I/O count in a compact FCBGA package for commercial embedded designs. Its specifications make it a practical choice for teams implementing complex digital functions, prototyping advanced logic, or integrating multiple high-density interfaces on a single board.
For engineering and procurement teams looking for a commercial-grade FPGA with clear on-chip resources and defined operating parameters, this Virtex®-5 LXT device offers predictable integration and deployment characteristics backed by AMD manufacturing.
Request a quote or submit an inquiry to our sales team to check availability and pricing for XC5VLX30T-1FFG665CES.

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Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








