XC5VLX30T-1FFG323I

The XC5VLX30T-1FFG323I is a Virtex‑5 LXT field programmable gate array (FPGA) manufactured by AMD. It provides a programmable logic fabric with substantial logic capacity, embedded memory, and a high I/O count in a compact 323‑ball FCBGA surface‑mount package.

Designed for applications that require a combination of logic resources, on‑chip RAM and industrial temperature operation, this device offers a configurable platform for implementing custom digital functions while operating from a 0.95 V to 1.05 V core supply.

Key Features

• Logic Capacity  Approximately 30,720 logic elements to implement complex combinational and sequential logic functions.
• Configurable Logic Blocks  2,400 logic blocks providing the structural elements for implementing programmable logic (referenced as logic resources).
• Embedded Memory  Approximately 1.33 Mbits of on‑chip RAM (1,327,104 bits) for data buffering, state storage and custom memory structures.
• I/O Density  172 user I/O pins to support broad interfacing and parallel connectivity requirements.
• Power and Core Voltage  Core supply range of 0.95 V to 1.05 V to match system power domains and enable consistent core operation.
• Package and Mounting  323‑ball FCBGA (323‑BBGA) in a 19 × 19 mm footprint; surface‑mount packaging for compact board integration.
• Temperature and Grade  Industrial grade device rated for operation from −40 °C to 100 °C for robust performance in demanding environments.
• RoHS Compliant  Meets RoHS requirements for lead‑free manufacturing and environmental compliance.

Typical Applications

• Industrial Control and Automation  Leverage the industrial temperature range and high I/O count to implement motor control, sensor interfaces, and deterministic control logic.
• Embedded System Integration  Use the approximately 30,720 logic elements and ~1.33 Mbits of embedded memory to implement custom peripherals, glue logic, and control functions within embedded platforms.
• Prototyping and System Validation  Deploy the device in development and validation environments where compact FCBGA packaging and surface‑mount integration are required.
• Protocol Bridging and I/O Expansion  Utilize the 172 I/O pins and sizable logic resources for protocol translation, buffering, and I/O aggregation tasks.

Unique Advantages

• Substantial Logic Resources: Approximately 30,720 logic elements enable implementation of complex digital designs without immediate need for multiple devices.
• Significant On‑Chip Memory: About 1.33 Mbits of embedded RAM supports local buffering, FIFOs and state storage to reduce external memory requirements.
• High I/O Count: 172 user I/Os provide flexibility for parallel interfaces, external device control and broad system connectivity.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in industrial environments and temperature‑sensitive applications.
• Compact Surface‑Mount Package: 323‑ball FCBGA (19×19) enables high‑density PCB layouts while maintaining accessible routing for complex systems.
• RoHS Compliance: Meets environmental regulations for lead‑free assembly and deployment.

Why Choose XC5VLX30T-1FFG323I?

The XC5VLX30T-1FFG323I combines a substantial pool of logic elements, meaningful on‑chip memory and a high I/O count in a compact industrial‑grade FCBGA package. Its specified core voltage range and temperature rating make it suitable for designs that demand stable core operation and robust environmental performance.

This FPGA is well suited to engineers and teams developing industrial control systems, embedded platforms and I/O‑intensive applications that require a configurable, integrated logic solution with clear, verifiable hardware characteristics.

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