XC5VLX30T-1FFG665I

IC FPGA 360 I/O 665FCBGA
Part Description

Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 360 1327104 30720 665-BBGA, FCBGA

Quantity 973 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package665-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case665-BBGA, FCBGANumber of I/O360Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2400Number of Logic Elements/Cells30720
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1327104

Overview of XC5VLX30T-1FFG665I – Virtex®-5 LXT FPGA, 665-FCBGA, Industrial

The XC5VLX30T-1FFG665I is a Virtex-5 LXT field programmable gate array (FPGA) from AMD designed for industrial-grade embedded applications. It combines a substantial logic resource set with embedded RAM and a large I/O count in a 665-ball FCBGA package, supporting designs that require significant on-chip integration and robust environmental range.

Key attributes include 30,720 logic elements, approximately 1.33 Mbits of embedded memory, 360 user I/Os, and an industrial operating temperature range, making it suitable for demanding system-level integration and interface consolidation.

Key Features

  • Core Logic — 30,720 logic elements and 2,400 configurable logic blocks provide a high-density programmable fabric for complex digital logic and control functions.
  • Embedded Memory — Approximately 1.33 Mbits of on-chip RAM supports buffering, state storage, and data-path implementations without external memory dependence.
  • I/O Capacity — 360 user I/Os enable broad peripheral and interface connectivity for multi-channel and mixed-signal system designs.
  • Power Supply — Operates from a core supply range of 950 mV to 1.05 V, allowing integration within regulated power domains common to modern FPGA systems.
  • Package & Mounting — Supplied in a 665-BBGA, FCBGA (665-FCBGA, 27×27 mm) surface-mount package for compact board-level integration.
  • Industrial Temperature Rating — Rated for operation from -40 °C to 100 °C to meet industrial environment requirements.
  • Regulatory Compliance — RoHS compliant for lead-free process compatibility.

Typical Applications

  • Industrial Control — Enables motor control, PLC interfaces, and real-time control functions with industrial temperature tolerance and extensive I/O resources.
  • Embedded Systems — Serves as a programmable fabric for embedded processing, custom peripherals, and system glue logic using its large logic and memory capacity.
  • Communications & Networking — Useful for protocol bridging and multi-channel interface management where numerous I/Os and on-chip logic are required.
  • Prototyping & Development — Provides a capable platform for hardware validation and iterative design with plentiful logic elements and embedded RAM.

Unique Advantages

  • High integration density: 30,720 logic elements reduce the need for external ASICs or glue logic, simplifying BOM and board complexity.
  • Substantial on-chip memory: Approximately 1.33 Mbits of embedded RAM supports local buffering and state machines without immediate external memory.
  • Broad I/O support: 360 user I/Os allow direct interfacing to multiple peripherals and subsystems, minimizing external interface components.
  • Industrial robustness: Rated from -40 °C to 100 °C to withstand a wide range of operating environments common in industrial deployments.
  • Compact package: 665-FCBGA (27×27 mm) offers a space-efficient footprint for high-density designs.
  • Regulatory readiness: RoHS compliance supports lead-free manufacturing processes.

Why Choose XC5VLX30T-1FFG665I?

The XC5VLX30T-1FFG665I positions itself as a versatile industrial-grade FPGA that balances programmable logic capacity, embedded memory, and extensive I/O in a compact FCBGA package. Its combination of 30,720 logic elements, approximately 1.33 Mbits of RAM, and 360 I/Os supports system-level consolidation and flexible design partitioning for embedded and industrial applications.

Choose this device when your design requires reliable operation across a wide temperature range, significant on-chip resources to minimize external components, and a compact surface-mount package for board-level integration and scalability.

If you need pricing or availability, request a quote or submit a purchase inquiry to get detailed lead-time and ordering information for the XC5VLX30T-1FFG665I.

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