XC5VLX30T-2FFG665C
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 360 1327104 30720 665-BBGA, FCBGA |
|---|---|
| Quantity | 668 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 665-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 665-BBGA, FCBGA | Number of I/O | 360 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2400 | Number of Logic Elements/Cells | 30720 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1327104 |
Overview of XC5VLX30T-2FFG665C – Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC
The XC5VLX30T-2FFG665C is a Virtex®-5 LXT FPGA IC from AMD, delivered in a 665-ball FCBGA package for surface-mount assembly. This device provides a high logic element count and substantial on-chip memory with a 360-pin I/O capability, suitable for designs requiring programmable logic and significant I/O integration.
Key Features
- Logic Capacity — 30,720 logic elements, enabling implementation of complex custom logic and control functions within a single device.
- Embedded Memory — Approximately 1.327 Mbits of on-chip RAM for frame buffers, FIFOs, and intermediate data storage.
- I/O Density — 360 user I/Os to support wide parallel interfaces and multiple external peripherals.
- Power — Core supply range of 950 mV to 1.05 V to match system power rails and support stable core operation.
- Package & Mounting — 665-FCBGA (27×27 mm) package in a surface-mount form factor for compact board integration.
- Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
- Compliance — RoHS-compliant construction for environmental and regulatory considerations.
Unique Advantages
- High logic density: 30,720 logic elements let you consolidate multiple functions into one FPGA, reducing component count and board complexity.
- Substantial on-chip memory: Approximately 1.327 Mbits of embedded RAM supports buffering and local data processing without immediate external memory dependency.
- Extensive I/O capability: 360 I/Os provide the flexibility to interface with a wide range of parallel buses, sensors, and peripheral devices.
- Compact FCBGA package: The 665-ball, 27×27 mm FCBGA enables a dense PCB footprint for space-constrained designs.
- Commercial temperature suitability: Rated 0 °C to 85 °C for typical commercial deployments and prototyping environments.
- RoHS compliant: Built to meet common environmental compliance requirements for modern electronic products.
Why Choose XC5VLX30T-2FFG665C?
The XC5VLX30T-2FFG665C positions itself as a commercially graded, high-capacity FPGA for projects that require significant programmable logic, on-chip memory, and abundant I/O in a compact surface-mount package. Its combination of 30,720 logic elements, approximately 1.327 Mbits of embedded RAM, and 360 I/Os makes it well suited for complex digital designs where integration and board space are important considerations.
Designed and manufactured by AMD, this Virtex®-5 LXT device delivers a balance of logic resources, memory, and I/O density for development, prototyping, and production systems that operate within commercial temperature ranges and RoHS requirements.
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