XC5VLX30T-2FFG665C

IC FPGA 360 I/O 665FCBGA
Part Description

Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 360 1327104 30720 665-BBGA, FCBGA

Quantity 668 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package665-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case665-BBGA, FCBGANumber of I/O360Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2400Number of Logic Elements/Cells30720
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1327104

Overview of XC5VLX30T-2FFG665C – Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC

The XC5VLX30T-2FFG665C is a Virtex®-5 LXT FPGA IC from AMD, delivered in a 665-ball FCBGA package for surface-mount assembly. This device provides a high logic element count and substantial on-chip memory with a 360-pin I/O capability, suitable for designs requiring programmable logic and significant I/O integration.

Key Features

  • Logic Capacity — 30,720 logic elements, enabling implementation of complex custom logic and control functions within a single device.
  • Embedded Memory — Approximately 1.327 Mbits of on-chip RAM for frame buffers, FIFOs, and intermediate data storage.
  • I/O Density — 360 user I/Os to support wide parallel interfaces and multiple external peripherals.
  • Power — Core supply range of 950 mV to 1.05 V to match system power rails and support stable core operation.
  • Package & Mounting — 665-FCBGA (27×27 mm) package in a surface-mount form factor for compact board integration.
  • Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • Compliance — RoHS-compliant construction for environmental and regulatory considerations.

Unique Advantages

  • High logic density: 30,720 logic elements let you consolidate multiple functions into one FPGA, reducing component count and board complexity.
  • Substantial on-chip memory: Approximately 1.327 Mbits of embedded RAM supports buffering and local data processing without immediate external memory dependency.
  • Extensive I/O capability: 360 I/Os provide the flexibility to interface with a wide range of parallel buses, sensors, and peripheral devices.
  • Compact FCBGA package: The 665-ball, 27×27 mm FCBGA enables a dense PCB footprint for space-constrained designs.
  • Commercial temperature suitability: Rated 0 °C to 85 °C for typical commercial deployments and prototyping environments.
  • RoHS compliant: Built to meet common environmental compliance requirements for modern electronic products.

Why Choose XC5VLX30T-2FFG665C?

The XC5VLX30T-2FFG665C positions itself as a commercially graded, high-capacity FPGA for projects that require significant programmable logic, on-chip memory, and abundant I/O in a compact surface-mount package. Its combination of 30,720 logic elements, approximately 1.327 Mbits of embedded RAM, and 360 I/Os makes it well suited for complex digital designs where integration and board space are important considerations.

Designed and manufactured by AMD, this Virtex®-5 LXT device delivers a balance of logic resources, memory, and I/O density for development, prototyping, and production systems that operate within commercial temperature ranges and RoHS requirements.

Request a quote or submit your requirements to get pricing and availability for the XC5VLX30T-2FFG665C. Our sales team can assist with lead times and order placement.

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