XC5VLX30T-3FFG665C

The XC5VLX30T-3FFG665C is a Virtex®-5 LXT Field Programmable Gate Array (FPGA) from AMD. It provides a programmable logic fabric with 30,720 logic elements and approximately 1.33 Mbits of on-chip RAM to address complex digital designs.

With 360 user I/O pins, a 665-ball FCBGA package (27×27 mm), a supply voltage range of 0.95 V to 1.05 V, and commercial-grade temperature operation (0 °C to 85 °C), this device targets system designs that require substantial I/O density, embedded memory, and a compact surface-mount form factor.

Key Features

• Programmable Logic: 30,720 logic elements for implementing custom digital functions and complex logic architectures.
• Embedded Memory: Approximately 1.33 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• I/O Capacity: 360 user I/Os to support wide parallel interfaces, sensor arrays, and multi-channel connectivity.
• Power and Core Voltage: Core voltage range of 0.95 V to 1.05 V for compatibility with system power domains and standard FPGA power rails.
• Package and Mounting: 665-ball FCBGA (665-BBGA) surface-mount package, supplier device package 665-FCBGA (27×27 mm), suited for compact board implementations.
• Operating Range: Commercial temperature grade with specified operation from 0 °C to 85 °C.
• Compliance: RoHS-compliant construction to meet lead-free and environmental requirements.

Typical Applications

• Custom digital logic: Implement application-specific processing and control functions using the device's 30,720 logic elements and on-chip RAM.
• Multi-channel I/O interfaces: Use the 360 I/O pins to aggregate and manage parallel data lanes, sensor arrays, or modular I/O expansions.
• Embedded prototyping and development: Deploy the FCBGA package in compact prototypes where surface-mount FPGA integration and substantial logic resources are required.

Unique Advantages

• Substantial logic density: 30,720 logic elements provide the capacity to implement sizable custom logic blocks without external gate arrays.
• Integrated on-chip memory: Approximately 1.33 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
• High I/O count: 360 user I/Os enable flexible interfacing to a broad range of peripherals and parallel buses.
• Compact FCBGA package: 665-ball FCBGA (27×27 mm) delivers a high-pin-count footprint in a surface-mount form factor for dense board layouts.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for typical commercial electronic applications.
• RoHS compliant: Meets lead-free and environmental compliance requirements for modern manufacturing processes.

Why Choose XC5VLX30T-3FFG665C?

The XC5VLX30T-3FFG665C balances significant programmable logic resources, embedded memory, and a high I/O count in a compact 665-FCBGA package. Its electrical and mechanical characteristics make it suitable for system designs that require on-chip memory, extensive I/O connectivity, and surface-mount integration at commercial temperature ranges.

Manufactured by AMD, this Virtex®-5 LXT FPGA offers a predictable set of capabilities for developers and procurement teams looking to implement sizable custom logic and interface requirements while maintaining RoHS compliance and standard supply-voltage operation.

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