XC5VLX330-2FF1760C

The XC5VLX330-2FF1760C is a Virtex®-5 LX field programmable gate array (FPGA) from AMD supplied in a 1760-ball FCBGA package (42.5 × 42.5 mm). It delivers a high density of programmable logic, embedded RAM, and I/O, targeting commercial designs that require large-scale integration and configurable hardware resources.

With hundreds of thousands of logic elements, more than ten megabits of on-chip memory and up to 1,200 I/O pins, this device is suited to complex digital systems where integration, I/O density and on-chip memory are key design requirements.

Key Features

• Core Logic Capacity — 331,776 logic elements organized across the device provide substantial programmable logic resources for large designs.
• Configurable Logic Blocks (CLBs) — 25,920 CLBs to structure logic for complex implementations and hierarchical design.
• Embedded Memory — Approximately 10.6 Mbits of total on-chip RAM for buffering, lookup tables and local data storage.
• I/O Density — Up to 1,200 user I/O pins to support wide parallel interfaces and multiple high-pin-count peripherals.
• Power Supply — Core voltage support from 0.95 V to 1.05 V to match system power domains and constraints.
• Package and Mounting — 1760-FCBGA (42.5 × 42.5 mm) surface-mount package for high-density board-level integration.
• Operating Range — Commercial-grade operation from 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance — RoHS-compliant construction.

Typical Applications

• High-density digital systems — Use where large logic capacity and substantial on-chip RAM are required to implement complex algorithms and data paths.
• Communications equipment — Suitable for designs that need extensive I/O and flexible logic for implementing interfaces and protocol processing.
• Prototyping and system integration — Fits development platforms and integration projects that consolidate multiple functions into a single programmable device.

Unique Advantages

• High logic scale: 331,776 logic elements enable large, feature-rich designs without immediate migration to multiple devices.
• Substantial on-chip memory: Approximately 10.6 Mbits of embedded RAM reduces external memory requirements for many applications.
• Extensive I/O capability: Up to 1,200 I/Os simplify board-level routing and support multiple parallel interfaces.
• Compact high-density package: The 1760-FCBGA (42.5 × 42.5 mm) package balances pin count with a manageable PCB footprint.
• Commercial temperature and RoHS compliance: Designed for standard commercial environments while meeting RoHS environmental requirements.
• Low-voltage core operation: Core supply range of 0.95 V to 1.05 V to align with modern power domains.

Why Choose XC5VLX330-2FF1760C?

The XC5VLX330-2FF1760C positions itself as a high-capacity, commercially rated FPGA for engineers and teams building complex digital systems that demand significant programmable logic, embedded memory and high I/O counts in a single device. Its combination of hundreds of thousands of logic elements, large on-chip RAM and 1,200 I/Os makes it a practical choice where consolidation and integration are priorities.

For commercial applications that require scalable logic resources and a high-density package, this Virtex®-5 LX device provides a platform that supports advanced implementation needs while remaining within standard temperature and environmental compliance parameters.

Request a quote or submit an inquiry to evaluate the XC5VLX330-2FF1760C for your next design project.