XC5VLX330T-1FFG1738C

IC FPGA 960 I/O 1738FCBGA
Part Description

Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 960 11943936 331776 1738-BBGA, FCBGA

Quantity 480 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1738-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1738-BBGA, FCBGANumber of I/O960Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs25920Number of Logic Elements/Cells331776
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits11943936

Overview of XC5VLX330T-1FFG1738C – Virtex®-5 LXT Field Programmable Gate Array (FPGA), 1738-FCBGA

The XC5VLX330T-1FFG1738C is a Virtex®-5 LXT field programmable gate array (FPGA) IC from AMD, offered in a 1738-FCBGA package. It provides substantial on-chip logic capacity and memory with a commercial-grade operating range and RoHS compliance.

Key Features

  • Core Logic 331,776 logic elements provide extensive programmable logic resources for complex designs.
  • Embedded Memory Approximately 11.9 Mbits of on-chip RAM (11,943,936 total RAM bits) for buffering, FIFO, and storage needs.
  • I/O Resources 960 I/O pins to support broad interfacing and system-level connectivity.
  • Power Core supply range of 0.950 V to 1.05 V to align with system power requirements.
  • Package and Mounting 1738-FCBGA package (1738-BBGA, FCBGA; supplier package 1738-FCBGA, 42.5 × 42.5 mm) with surface-mount mounting type for board-level integration.
  • Operating Conditions Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High logic capacity: 331,776 logic elements allow consolidation of complex functions within a single device.
  • Substantial on-chip RAM: Approximately 11.9 Mbits of embedded memory supports large buffering and data-path implementations without external memory.
  • Extensive I/O count: 960 I/O pins enable dense external interfacing and flexible board-level connectivity options.
  • Compact FCBGA footprint: The 1738-FCBGA (42.5 × 42.5 mm) package provides a high-density solution suitable for compact system designs.
  • Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliance for regulatory alignment in commercial products.

Why Choose XC5VLX330T-1FFG1738C?

The XC5VLX330T-1FFG1738C combines a large logic fabric, significant embedded memory, and a high I/O count in a single Virtex‑5 LXT FPGA package from AMD. Its electrical and mechanical specifications make it suitable for commercial applications that require dense programmable logic and on-chip memory in a surface-mount FCBGA form factor.

For designs that need extensive internal resources and broad interfacing capabilities within a commercial temperature range, this Virtex‑5 LXT device offers a scalable option backed by the device-level specifications provided by the manufacturer.

Request a quote or submit an inquiry for pricing and availability of the XC5VLX330T-1FFG1738C.

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