XC5VLX50-1FF1153C
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 560 1769472 46080 1153-BBGA, FCBGA |
|---|---|
| Quantity | 579 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1153-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1153-BBGA, FCBGA | Number of I/O | 560 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 3600 | Number of Logic Elements/Cells | 46080 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1769472 |
Overview of XC5VLX50-1FF1153C – Virtex®-5 LX FPGA (1153‑FCBGA, 35×35)
The XC5VLX50-1FF1153C is a Virtex®-5 LX field programmable gate array (FPGA) manufactured by AMD. It provides a balance of logic capacity, on-chip memory and high I/O density in a 1153‑FCBGA (35×35) surface-mount package for commercial-grade embedded designs.
With 46,080 logic elements, approximately 1.77 Mbits of embedded memory and 560 user I/Os, this device is suited to applications that require substantial logic resources, significant on-chip RAM, and extensive I/O connectivity while operating at standard commercial temperature and voltage ranges.
Key Features
- Core Logic 46,080 logic elements provide programmable resources for custom digital logic, control functions and glue-logic integration.
- Embedded Memory Approximately 1.77 Mbits of on-chip RAM for buffering, FIFOs and local data storage without external memory dependence.
- I/O Density 560 user I/O pins support dense interfaces and multi-channel connectivity directly from the FPGA package.
- Power Supply Core voltage operating range from 0.950 V to 1.05 V to match system power rails and ensure defined core operation.
- Package & Mounting 1153‑FCBGA (35×35) package with surface-mount mounting type for compact board designs and high-density routing.
- Operating Conditions Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for standard commercial deployments.
Typical Applications
- High‑density I/O systems Use the 560 I/Os to implement multi‑channel interfaces, parallel buses or mixed-signal front-ends that require many external connections.
- Embedded logic and control Leverage 46,080 logic elements to implement custom control logic, state machines and protocol handling in embedded systems.
- On‑chip buffering and packet handling Approximately 1.77 Mbits of embedded RAM enable local packet buffering, FIFOs and temporary storage for streaming or bursty data flows.
Unique Advantages
- Substantial logic capacity: 46,080 logic elements allow implementation of complex digital functions and integration of multiple subsystems on a single device, reducing overall BOM count.
- High I/O count: 560 user I/Os give design flexibility for dense external connectivity without expanding to multiple devices.
- On‑chip memory resources: Approximately 1.77 Mbits of embedded RAM reduce reliance on external memory components and simplify board design.
- Compact FCBGA package: The 1153‑FCBGA (35×35) package supports high pin density in a compact footprint, aiding space-constrained PCB layouts.
- Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant, suitable for standard commercial electronic products and supply chains.
Why Choose XC5VLX50-1FF1153C?
The XC5VLX50-1FF1153C offers a balanced combination of programmable logic, on-chip RAM and extensive I/O in a compact FCBGA package from AMD’s Virtex‑5 family. Its specification set supports designs that need significant logic capacity and local memory while providing the I/O bandwidth required for complex interfacing tasks.
This device is ideal for engineering teams designing commercial embedded systems, communication interfaces and high-density I/O applications that value integrated resources and a compact package. The combination of logic, memory and I/O helps simplify board-level architecture and supports scalable design iterations.
Request a quote or submit an inquiry to obtain pricing and availability for the XC5VLX50-1FF1153C. Our team can provide lead-time information and support for your procurement process.

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