XC5VLX50-1FF1153C

IC FPGA 560 I/O 1153FCBGA
Part Description

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 560 1769472 46080 1153-BBGA, FCBGA

Quantity 579 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1153-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1153-BBGA, FCBGANumber of I/O560Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs3600Number of Logic Elements/Cells46080
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1769472

Overview of XC5VLX50-1FF1153C – Virtex®-5 LX FPGA (1153‑FCBGA, 35×35)

The XC5VLX50-1FF1153C is a Virtex®-5 LX field programmable gate array (FPGA) manufactured by AMD. It provides a balance of logic capacity, on-chip memory and high I/O density in a 1153‑FCBGA (35×35) surface-mount package for commercial-grade embedded designs.

With 46,080 logic elements, approximately 1.77 Mbits of embedded memory and 560 user I/Os, this device is suited to applications that require substantial logic resources, significant on-chip RAM, and extensive I/O connectivity while operating at standard commercial temperature and voltage ranges.

Key Features

  • Core Logic  46,080 logic elements provide programmable resources for custom digital logic, control functions and glue-logic integration.
  • Embedded Memory  Approximately 1.77 Mbits of on-chip RAM for buffering, FIFOs and local data storage without external memory dependence.
  • I/O Density  560 user I/O pins support dense interfaces and multi-channel connectivity directly from the FPGA package.
  • Power Supply  Core voltage operating range from 0.950 V to 1.05 V to match system power rails and ensure defined core operation.
  • Package & Mounting  1153‑FCBGA (35×35) package with surface-mount mounting type for compact board designs and high-density routing.
  • Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for standard commercial deployments.

Typical Applications

  • High‑density I/O systems  Use the 560 I/Os to implement multi‑channel interfaces, parallel buses or mixed-signal front-ends that require many external connections.
  • Embedded logic and control  Leverage 46,080 logic elements to implement custom control logic, state machines and protocol handling in embedded systems.
  • On‑chip buffering and packet handling  Approximately 1.77 Mbits of embedded RAM enable local packet buffering, FIFOs and temporary storage for streaming or bursty data flows.

Unique Advantages

  • Substantial logic capacity: 46,080 logic elements allow implementation of complex digital functions and integration of multiple subsystems on a single device, reducing overall BOM count.
  • High I/O count: 560 user I/Os give design flexibility for dense external connectivity without expanding to multiple devices.
  • On‑chip memory resources: Approximately 1.77 Mbits of embedded RAM reduce reliance on external memory components and simplify board design.
  • Compact FCBGA package: The 1153‑FCBGA (35×35) package supports high pin density in a compact footprint, aiding space-constrained PCB layouts.
  • Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant, suitable for standard commercial electronic products and supply chains.

Why Choose XC5VLX50-1FF1153C?

The XC5VLX50-1FF1153C offers a balanced combination of programmable logic, on-chip RAM and extensive I/O in a compact FCBGA package from AMD’s Virtex‑5 family. Its specification set supports designs that need significant logic capacity and local memory while providing the I/O bandwidth required for complex interfacing tasks.

This device is ideal for engineering teams designing commercial embedded systems, communication interfaces and high-density I/O applications that value integrated resources and a compact package. The combination of logic, memory and I/O helps simplify board-level architecture and supports scalable design iterations.

Request a quote or submit an inquiry to obtain pricing and availability for the XC5VLX50-1FF1153C. Our team can provide lead-time information and support for your procurement process.

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