XC5VLX50-1FF1153I

The XC5VLX50-1FF1153I is a Virtex®-5 LX field programmable gate array (FPGA) from AMD, provided in a 1153-ball FCBGA package (35 × 35 mm). It delivers a combination of sizable logic capacity, embedded memory, and a high I/O count targeted for industrial-grade applications that require programmable, reconfigurable silicon.

Key device attributes include approximately 46,080 logic elements, roughly 1.77 Mbits of on-chip RAM, support for up to 560 I/O pins, a low-voltage core supply range of 0.95 V to 1.05 V, and an operating temperature range of −40 °C to 100 °C.

Key Features

• Logic Capacity  Approximately 46,080 logic elements implemented across 3,600 configurable logic blocks (CLBs), enabling complex programmable logic implementations.
• Embedded Memory  Total on-chip RAM of 1,769,472 bits (approximately 1.77 Mbits) for buffering, state storage, and local data processing.
• I/O Density  Up to 560 I/O pins to support high-channel-count interfaces and broad connectivity on a single device.
• Power  Core voltage supply range of 0.95 V to 1.05 V for the device core.
• Package and Mounting  1153-ball FCBGA package (35 × 35 mm), designed for surface-mount board assembly.
• Temperature and Grade  Industrial-grade device with an operating temperature range from −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant for reduced hazardous substances in manufacturing.

Unique Advantages

• High programmable logic density: The approximately 46,080 logic elements provide the capacity to implement large, partitioned designs on a single FPGA, reducing the need for multiple devices.
• On-chip memory for local data handling: Approximately 1.77 Mbits of embedded RAM enables on-device buffering and state storage, lowering external memory dependence.
• Extensive I/O resources: Up to 560 I/O pins support integration with multiple peripherals and parallel interfaces without additional bridging components.
• Industrial temperature range: Rated for −40 °C to 100 °C operation, supporting deployments in a wide range of environmental conditions.
• Compact BGA footprint: The 1153-FCBGA (35 × 35 mm) package provides a high-pin-count solution in a board-space-efficient form factor for dense system designs.
• Regulatory readiness: RoHS compliance simplifies adoption in manufacturing environments with hazardous-substance restrictions.

Why Choose XC5VLX50-1FF1153I?

The XC5VLX50-1FF1153I combines substantial logic resources, embedded memory, and a high I/O count in a compact FCBGA package, positioned for industrial-grade applications that need reconfigurable hardware with robust environmental tolerance. Its low-voltage core and industry-standard package support integration into existing board-level designs while providing the flexibility of FPGA-based implementations.

This device is suitable for designers seeking a scalable, high-density programmable platform with on-chip memory and extensive connectivity, backed by AMD's Virtex-5 product lineage.

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