XC5VLX330-1FF1760I

The XC5VLX330-1FF1760I is a Virtex®-5 LX field programmable gate array (FPGA) IC that provides a large programmable fabric paired with substantial embedded memory and high I/O capacity. Its combination of 331,776 logic elements, approximately 10.6 Mbits of on-chip RAM and 1,200 user I/O pins makes it suitable for designs that require significant logic density and wide peripheral connectivity.

Delivered in a 1760-FCBGA (42.5×42.5 mm) surface-mount package and rated for industrial operation from -40°C to 100°C, this device operates from a core supply range of 950 mV to 1.05 V and is RoHS compliant.

Key Features

• Core Logic — 331,776 logic elements and 25,920 configurable logic blocks (CLBs) provide extensive programmable resources for complex digital designs.
• Embedded Memory — Total on-chip RAM of 10,616,832 bits (approximately 10.6 Mbits) for local data buffering, FIFOs and state storage.
• I/O Capacity — 1,200 user I/O pins to support broad connectivity and multiple external interfaces at the board level.
• Power Supply — Core voltage supply range of 950 mV to 1.05 V for the device core.
• Package and Mounting — 1760-FCBGA (42.5×42.5 mm) package, surface mount mounting type for board-level deployment.
• Temperature and Grade — Industrial-grade device rated for operation from -40°C to 100°C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Logic‑dense FPGA designs — Large programmable fabric supports complex state machines, custom accelerators and multi-stage processing pipelines.
• I/O‑rich systems — 1,200 user I/O pins enable aggregation of numerous peripherals and board-level interfaces.
• Memory-centric processing — Approximately 10.6 Mbits of embedded RAM for buffering, packet storage or intermediate data handling within the FPGA.
• Industrial control systems — Industrial-grade rating and extended temperature range support deployment in factory and industrial environments.

Unique Advantages

• Large programmable fabric: 331,776 logic elements and 25,920 CLBs give designers headroom for complex logic integration without external ASICs.
• Substantial on-chip memory: Approximately 10.6 Mbits of embedded RAM reduces dependence on external memory for many buffering and packet-processing tasks.
• High I/O count: 1,200 user I/O pins simplify system integration by accommodating multiple interfaces and signals directly on the FPGA.
• Industrial-grade operation: Rated from -40°C to 100°C, suitable for systems that require extended temperature performance.
• Compact, surface-mount package: 1760-FCBGA (42.5×42.5 mm) package enables high-density board designs while maintaining robust mounting.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC5VLX330-1FF1760I?

The XC5VLX330-1FF1760I positions itself as a high-density, industrial-grade FPGA offering a balance of large logic capacity, significant embedded memory and extensive I/O. These attributes make it well suited for engineers developing complex digital systems that require on-chip resources to minimize external components and streamline board-level integration.

Its 1760-FCBGA surface-mount package, defined supply voltage range and extended operating temperature range provide a combination of integration and robustness that supports long-term deployment in demanding environments.

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