XC5VLX30T-2FF665I
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 360 1327104 30720 665-BBGA, FCBGA |
|---|---|
| Quantity | 1,305 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 665-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 665-BBGA, FCBGA | Number of I/O | 360 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2400 | Number of Logic Elements/Cells | 30720 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1327104 |
Overview of XC5VLX30T-2FF665I – Virtex®-5 LXT Field Programmable Gate Array (FPGA)
The XC5VLX30T-2FF665I is a Virtex®-5 LXT Field Programmable Gate Array (FPGA) optimized for designs that require substantial logic capacity, embedded memory, and high I/O density. It delivers a configurable hardware platform packaged in a 665-ball FCBGA suitable for surface-mount assembly.
Targeted toward industrial environments, this device provides industrial-grade temperature support and power specifications that match demanding embedded and control applications where sustained operation across temperature and voltage ranges is required.
Key Features
- Logic Capacity Approximately 30,720 logic elements and 2,400 configurable logic blocks (CLBs) provide abundant programmable resources for complex digital designs.
- Embedded Memory Approximately 1.33 Mbits of on-chip RAM (1,327,104 bits) for buffering, FIFOs, and local data storage without external memory.
- I/O Density 360 I/O pins to support a wide variety of peripheral interfaces and board-level connectivity options.
- Power Core supply range of 0.95 V to 1.05 V, enabling designs to target the specified core voltage window for reliable operation.
- Package 665-ball FCBGA package (665-FCBGA, 27×27 mm) designed for high-density board layouts and surface-mount assembly.
- Operating Range Industrial-grade temperature support from −40 °C to 100 °C for reliable operation in harsh environments.
- RoHS Compliance RoHS compliant for lead-free manufacturing requirements.
Typical Applications
- Industrial Control and Automation Industrial-grade temperature range and robust logic/memory resources support control algorithms, signal processing, and I/O aggregation in automation systems.
- Embedded Systems High logic element and on-chip memory capacity enable integration of custom logic, protocol bridges, and data path acceleration within embedded platforms.
- High-Density I/O Systems 360 available I/O pins allow this FPGA to interface with numerous sensors, converters, and high-speed peripherals on crowded PCBs.
Unique Advantages
- Substantial Programmable Resources: The combination of ~30,720 logic elements and 2,400 CLBs supports complex state machines, datapaths, and custom accelerators without immediate need for external logic.
- On-Chip Memory: Approximately 1.33 Mbits of embedded RAM reduces dependence on external memory for buffering and local data storage, simplifying BOM and board design.
- High I/O Count: 360 I/Os provide flexibility for multi-channel interfacing, expansion headers, and parallel buses on a single device.
- Industrial Temperature Rating: Operation from −40 °C to 100 °C accommodates deployment in industrial and outdoor equipment with wider thermal demands.
- Compact, High-Density Package: 665-FCBGA (27×27 mm) enables dense board integration while maintaining the solderable surface-mount form factor.
- Regulatory Readiness: RoHS compliance supports lead-free manufacturing and helps meet regulatory requirements for many global markets.
Why Choose XC5VLX30T-2FF665I?
The XC5VLX30T-2FF665I positions itself as an industrial-grade, high-capacity FPGA option from AMD’s Virtex-5 LXT family, combining significant logic and embedded memory with a high I/O count and a robust operating temperature range. Its 665-ball FCBGA package and surface-mount compatibility make it suitable for compact, production-grade systems.
This part is well suited for design teams needing a scalable, programmable hardware building block capable of handling complex digital logic and extensive interfacing in industrial and embedded applications, while meeting RoHS requirements and operating across a wide temperature range.
Request a quote or submit an inquiry to obtain pricing and availability for the XC5VLX30T-2FF665I.

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