XC5VLX30T-2FF665I

IC FPGA 360 I/O 665FCBGA
Part Description

Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 360 1327104 30720 665-BBGA, FCBGA

Quantity 1,305 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package665-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case665-BBGA, FCBGANumber of I/O360Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2400Number of Logic Elements/Cells30720
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1327104

Overview of XC5VLX30T-2FF665I – Virtex®-5 LXT Field Programmable Gate Array (FPGA)

The XC5VLX30T-2FF665I is a Virtex®-5 LXT Field Programmable Gate Array (FPGA) optimized for designs that require substantial logic capacity, embedded memory, and high I/O density. It delivers a configurable hardware platform packaged in a 665-ball FCBGA suitable for surface-mount assembly.

Targeted toward industrial environments, this device provides industrial-grade temperature support and power specifications that match demanding embedded and control applications where sustained operation across temperature and voltage ranges is required.

Key Features

  • Logic Capacity  Approximately 30,720 logic elements and 2,400 configurable logic blocks (CLBs) provide abundant programmable resources for complex digital designs.
  • Embedded Memory  Approximately 1.33 Mbits of on-chip RAM (1,327,104 bits) for buffering, FIFOs, and local data storage without external memory.
  • I/O Density  360 I/O pins to support a wide variety of peripheral interfaces and board-level connectivity options.
  • Power  Core supply range of 0.95 V to 1.05 V, enabling designs to target the specified core voltage window for reliable operation.
  • Package  665-ball FCBGA package (665-FCBGA, 27×27 mm) designed for high-density board layouts and surface-mount assembly.
  • Operating Range  Industrial-grade temperature support from −40 °C to 100 °C for reliable operation in harsh environments.
  • RoHS Compliance  RoHS compliant for lead-free manufacturing requirements.

Typical Applications

  • Industrial Control and Automation  Industrial-grade temperature range and robust logic/memory resources support control algorithms, signal processing, and I/O aggregation in automation systems.
  • Embedded Systems  High logic element and on-chip memory capacity enable integration of custom logic, protocol bridges, and data path acceleration within embedded platforms.
  • High-Density I/O Systems  360 available I/O pins allow this FPGA to interface with numerous sensors, converters, and high-speed peripherals on crowded PCBs.

Unique Advantages

  • Substantial Programmable Resources: The combination of ~30,720 logic elements and 2,400 CLBs supports complex state machines, datapaths, and custom accelerators without immediate need for external logic.
  • On-Chip Memory: Approximately 1.33 Mbits of embedded RAM reduces dependence on external memory for buffering and local data storage, simplifying BOM and board design.
  • High I/O Count: 360 I/Os provide flexibility for multi-channel interfacing, expansion headers, and parallel buses on a single device.
  • Industrial Temperature Rating: Operation from −40 °C to 100 °C accommodates deployment in industrial and outdoor equipment with wider thermal demands.
  • Compact, High-Density Package: 665-FCBGA (27×27 mm) enables dense board integration while maintaining the solderable surface-mount form factor.
  • Regulatory Readiness: RoHS compliance supports lead-free manufacturing and helps meet regulatory requirements for many global markets.

Why Choose XC5VLX30T-2FF665I?

The XC5VLX30T-2FF665I positions itself as an industrial-grade, high-capacity FPGA option from AMD’s Virtex-5 LXT family, combining significant logic and embedded memory with a high I/O count and a robust operating temperature range. Its 665-ball FCBGA package and surface-mount compatibility make it suitable for compact, production-grade systems.

This part is well suited for design teams needing a scalable, programmable hardware building block capable of handling complex digital logic and extensive interfacing in industrial and embedded applications, while meeting RoHS requirements and operating across a wide temperature range.

Request a quote or submit an inquiry to obtain pricing and availability for the XC5VLX30T-2FF665I.

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