XC5VLX30T-1FFG665C

The XC5VLX30T-1FFG665C is a Virtex®-5 LXT field programmable gate array IC from AMD. It integrates 30,720 logic elements and approximately 1.33 Mbits of on-chip RAM, providing a balanced combination of logic capacity and embedded memory in a compact FCBGA package.

Designed for surface-mount board assembly, this commercial-grade device provides 360 I/O pins and operates from 950 mV to 1.05 V with an ambient temperature range of 0 °C to 85 °C. It is RoHS-compliant.

Key Features

• Core Capacity 30,720 logic elements and 2,400 CLBs provide substantial logic resources for complex digital designs.
• Embedded Memory Approximately 1.33 Mbits of on-chip RAM for data buffering, state storage, and memory-intensive logic functions.
• I/O Resources 360 I/O pins to support broad interfacing and connectivity options on a single device.
• Package 665-ball FCBGA package (665-FCBGA (27×27)) in a 665-BBGA/FCBGA case suitable for high-density board layouts.
• Power Core supply range of 950 mV to 1.05 V to match low-voltage system architectures.
• Mounting Surface-mount device optimized for standard PCB assembly processes.
• Temperature Rating Commercial operating range from 0 °C to 85 °C.
• Environmental Compliance RoHS-compliant to meet common environmental and lead-free requirements.

Unique Advantages

• Substantial Logic Density: 30,720 logic elements and 2,400 CLBs enable implementation of complex functions without external logic expansion.
• Integrated On-Chip Memory: Approximately 1.33 Mbits of embedded RAM reduces dependency on off-chip memory for many buffering and storage tasks.
• Extensive I/O Count: 360 I/Os allow flexible interfacing to peripherals, sensors, and other system components from a single FPGA.
• Compact Ball-Grid Package: 665-FCBGA (27×27) offers a high pin count in a manageable footprint for dense board designs.
• Low-Voltage Core Support: 950 mV to 1.05 V supply compatibility supports integration into modern low-voltage power domains.
• Commercial Grade: Specified 0 °C to 85 °C operating temperature for use in commercial product environments.

Why Choose XC5VLX30T-1FFG665C?

The XC5VLX30T-1FFG665C combines a significant logic element count, ample embedded memory, and a high I/O count within a 665-ball FCBGA package, offering a tightly integrated solution for designs that require moderate to high logic and memory resources. Its low core voltage range and surface-mount FCBGA packaging make it suitable for compact, power-conscious commercial applications.

This device is well-suited to engineers and procurement teams specifying FPGAs for commercial product lines that need defined operating temperature, RoHS compliance, and a balance of logic, memory, and I/O capacity in a single-chip solution.

Request a quote or submit a pricing inquiry to evaluate the XC5VLX30T-1FFG665C for your next design project.